{"title":"Experimental investigation on magnetorheological shear thickening polishing characteristics for SiC substrate","authors":"","doi":"10.1016/j.ceramint.2024.07.392","DOIUrl":null,"url":null,"abstract":"<p>Silicon carbide (SiC) substrates are widely used in semiconductor and photoelectric applications due to excellent electrical and chemical properties. However, due to its inherent hard-brittle properties and chemical inertness, traditional polishing processes are facing great challenges to obtain excellent surface and subsurface quality for the SiC substrates. In this work, a novel polishing process i.e. magnetorheological shear thickening polishing (MRSTP) was proposed to explore the feasibility for the polishing of the SiC substrates. The MRSTP experiments were conducted using multiple magnetic-pole-coupled tools. The magnetic field characteristics of the polishing area were investigated via finite element simulation and actual measurements. The magnetic-pole-coupled tool was capable of generating high magnetic induction strength in the polishing area. The MRSTP medium was designed and prepared. The media were formed magnetic brushes by the excited magnetic field. The MRSTP experiments were conducted to investigate the effects of processing parameters on the polished surface roughness. The optimum process parameters were determined as the spindle rotational speed of 700 rpm, the feed rate of 600 mm/min, the work gap of 0.5 mm and MRSTP media CIPs particle size of 100 μm. The surface roughness of the workpieces was improved from initial 1.414 μm to 27.6 nm. It is verified that the MRSTP is the feasible ultraprecision polishing process for the SiC substrates.</p>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":null,"pages":null},"PeriodicalIF":5.1000,"publicationDate":"2024-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1016/j.ceramint.2024.07.392","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
Silicon carbide (SiC) substrates are widely used in semiconductor and photoelectric applications due to excellent electrical and chemical properties. However, due to its inherent hard-brittle properties and chemical inertness, traditional polishing processes are facing great challenges to obtain excellent surface and subsurface quality for the SiC substrates. In this work, a novel polishing process i.e. magnetorheological shear thickening polishing (MRSTP) was proposed to explore the feasibility for the polishing of the SiC substrates. The MRSTP experiments were conducted using multiple magnetic-pole-coupled tools. The magnetic field characteristics of the polishing area were investigated via finite element simulation and actual measurements. The magnetic-pole-coupled tool was capable of generating high magnetic induction strength in the polishing area. The MRSTP medium was designed and prepared. The media were formed magnetic brushes by the excited magnetic field. The MRSTP experiments were conducted to investigate the effects of processing parameters on the polished surface roughness. The optimum process parameters were determined as the spindle rotational speed of 700 rpm, the feed rate of 600 mm/min, the work gap of 0.5 mm and MRSTP media CIPs particle size of 100 μm. The surface roughness of the workpieces was improved from initial 1.414 μm to 27.6 nm. It is verified that the MRSTP is the feasible ultraprecision polishing process for the SiC substrates.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.