Electrochemical additive manufacturing of copper parts: printed material properties vs. traditionally deposited

IF 2.6 4区化学 Q3 ELECTROCHEMISTRY

Journal of Solid State Electrochemistry Pub Date : 2024-07-27 DOI:10.1007/s10008-024-06026-x

Dmytro Uschpovskiy, Roman Babchuk, Mykhailo Kotyk, Viktoria Vorobyova, Georgii Vasyliev

引用次数: 0

Abstract

The present work investigates the properties of copper, being obtained by electrochemical 3D printing. The square copper object of 200 µm thickness was obtained from copper sulphate electrolyte. The mechanical and corrosion properties of the copper were investigated and compared to the galvanic and metallurgical copper. The Meier microhardness, Young’s modulus, and plasticity coefficients of electrochemically deposited copper correspond to the properties of 3D-printed copper within 5% accuracy. The linear polarization resistance technique, used in 3.5% NaCl solution, showed that the corrosion rate of printed copper (7.4 mA/cm²) lies in between the corrosion rate of metallurgical copper (11.1 mA/cm²) and the corrosion rate of galvanic copper (6.9 mA/cm²). Thus, the quality of the copper metal, obtained by 3D printing, remains the same as for traditional manufacturing making electrochemical printing a promising technology for copper parts production.

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铜零件的电化学增材制造：打印材料特性与传统沉积材料的对比

本作品研究了通过电化学三维打印技术获得的铜的特性。从硫酸铜电解液中获得了厚度为 200 微米的正方形铜物体。研究了铜的机械和腐蚀特性，并与电镀铜和冶金铜进行了比较。电化学沉积铜的迈尔显微硬度、杨氏模量和塑性系数与三维打印铜的特性相符，精确度在 5%以内。在 3.5% NaCl 溶液中使用的线性极化电阻技术表明，打印铜的腐蚀速率（7.4 mA/cm2）介于冶金铜的腐蚀速率（11.1 mA/cm2）和电镀铜的腐蚀速率（6.9 mA/cm2）之间。因此，通过三维打印获得的金属铜的质量与传统制造方法相同，这使得电化学打印成为一种很有前景的铜部件生产技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Solid State Electrochemistry 工程技术-电化学

CiteScore

4.80

自引率

4.00%

发文量

227

审稿时长

4.1 months

期刊介绍： The Journal of Solid State Electrochemistry is devoted to all aspects of solid-state chemistry and solid-state physics in electrochemistry. The Journal of Solid State Electrochemistry publishes papers on all aspects of electrochemistry of solid compounds, including experimental and theoretical, basic and applied work. It equally publishes papers on the thermodynamics and kinetics of electrochemical reactions if at least one actively participating phase is solid. Also of interest are articles on the transport of ions and electrons in solids whenever these processes are relevant to electrochemical reactions and on the use of solid-state electrochemical reactions in the analysis of solids and their surfaces. The journal covers solid-state electrochemistry and focusses on the following fields: mechanisms of solid-state electrochemical reactions, semiconductor electrochemistry, electrochemical batteries, accumulators and fuel cells, electrochemical mineral leaching, galvanic metal plating, electrochemical potential memory devices, solid-state electrochemical sensors, ion and electron transport in solid materials and polymers, electrocatalysis, photoelectrochemistry, corrosion of solid materials, solid-state electroanalysis, electrochemical machining of materials, electrochromism and electrochromic devices, new electrochemical solid-state synthesis. The Journal of Solid State Electrochemistry makes the professional in research and industry aware of this swift progress and its importance for future developments and success in the above-mentioned fields.