Small-size temperature/high-pressure integrated sensor via flip-chip method

IF 7.3 1区 工程技术 Q1 INSTRUMENTS & INSTRUMENTATION
Mimi Huang, Xiaoyu Wu, Libo Zhao, Xiangguang Han, Yong Xia, Yi Gao, Zeyu Cui, Cheng Zhang, Xiaokai Yang, Zhixia Qiao, Zhikang Li, Feng Han, Ping Yang, Zhuangde Jiang
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Abstract

Hydraulic technology with smaller sizes and higher reliability trends, including fault prediction and intelligent control, requires high-performance temperature and pressure-integrated sensors. Current designs rely on planar wafer- or chip-level integration, which is limited by pressure range, chip size, and low reliability. We propose a small-size temperature/high-pressure integrated sensor via the flip-chip technique. The pressure and temperature units are arranged vertically, and the sensing signals of the two units are integrated into one plane through silicon vias and gold–gold bonding, reducing the lateral size and improving the efficiency of signal transmission. The flip-chip technique ensures a reliable electrical connection. A square diaphragm with rounded corners is designed and optimised with simulation to sense high pressure based on the piezoresistive effect. The temperature sensing unit with a thin-film platinum resistor measures temperature and provides back-end high-precision compensation, which will improve the precision of the pressure unit. The integrated chip is fabricated by MEMS technology and packaged to fabricate the extremely small integrated sensor. The integrated sensor is characterised, and the pressure sensor exhibits a sensitivity and sensitivity drift of 7.97 mV/MPa and −0.19% FS in the range of 0–20 MPa and −40 to 120 °C. The linearity, hysteresis, repeatability, accuracy, basic error, and zero-time drift are 0.16% FS, 0.04% FS, 0.06% FS, 0.18% FS, ±0.23% FS and 0.04% FS, respectively. The measurement error of the temperature sensor and temperature coefficient of resistance is less than ±1 °C and 3142.997 ppm/°C, respectively. The integrated sensor has broad applicability in fault diagnosis and safety monitoring of high-end equipment such as automobile detection, industrial equipment, and oil drilling platforms.

Abstract Image

通过倒装芯片法实现小型温度/高压集成传感器
液压技术具有体积更小、可靠性更高的趋势,包括故障预测和智能控制,因此需要高性能的温度和压力集成传感器。目前的设计依赖于平面晶圆或芯片级集成,这受到压力范围、芯片尺寸和低可靠性的限制。我们提出了一种采用倒装芯片技术的小尺寸温度/高压集成传感器。压力和温度单元垂直排列,两个单元的传感信号通过硅通孔和金-金键合集成在一个平面上,从而减小了横向尺寸,提高了信号传输效率。倒装芯片技术确保了可靠的电气连接。设计和优化的圆角方形膜片基于压阻效应感应高压。带有薄膜铂电阻的温度传感单元可测量温度并提供后端高精度补偿,从而提高压力单元的精度。集成芯片采用 MEMS 技术制造,并封装成极小的集成传感器。对集成传感器进行了表征,压力传感器在 0-20 兆帕和 -40 至 120 ℃ 范围内的灵敏度和灵敏度漂移分别为 7.97 mV/MPa 和 -0.19% FS。线性度、滞后、重复性、准确度、基本误差和零时漂移分别为 0.16% FS、0.04% FS、0.06% FS、0.18% FS、±0.23% FS 和 0.04% FS。温度传感器和电阻温度系数的测量误差分别小于 ±1°C 和 3142.997 ppm/°C。该集成传感器可广泛应用于汽车检测、工业设备和石油钻井平台等高端设备的故障诊断和安全监控。
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来源期刊
Microsystems & Nanoengineering
Microsystems & Nanoengineering Materials Science-Materials Science (miscellaneous)
CiteScore
12.00
自引率
3.80%
发文量
123
审稿时长
20 weeks
期刊介绍: Microsystems & Nanoengineering is a comprehensive online journal that focuses on the field of Micro and Nano Electro Mechanical Systems (MEMS and NEMS). It provides a platform for researchers to share their original research findings and review articles in this area. The journal covers a wide range of topics, from fundamental research to practical applications. Published by Springer Nature, in collaboration with the Aerospace Information Research Institute, Chinese Academy of Sciences, and with the support of the State Key Laboratory of Transducer Technology, it is an esteemed publication in the field. As an open access journal, it offers free access to its content, allowing readers from around the world to benefit from the latest developments in MEMS and NEMS.
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