Relationship between the polyurea underlayer structure and PEG surface coverage

IF 1.5 4区物理与天体物理 Q3 PHYSICS, APPLIED

Japanese Journal of Applied Physics Pub Date : 2024-07-15 DOI:10.35848/1347-4065/ad5cb3

Ryo Tabata, Ryosuke Matsubara and Atsushi Kubono

引用次数: 0

Abstract

Increasing the surface coverage of antifouling materials is essential to enhance the performance of antifouling coatings. In this study, polyurea thin-film underlayers were fabricated by co-depositing difunctional isocyanates with difunctional or trifunctional amines. The relationships among the underlayer structure, terminal group density before polyethylene glycol (PEG) termination, and PEG surface coverage were investigated. The results showed that employing trifunctional amines in the underlayer led to increased terminal group density before PEG termination. Moreover, the reduced hydrogen-bonding capability between the polyurea molecules contributes to enhanced PEG surface coverage.

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聚脲底层结构与 PEG 表面覆盖率之间的关系

增加防污材料的表面覆盖率对于提高防污涂料的性能至关重要。本研究通过将双官能异氰酸酯与双官能或三官能胺共沉积来制造聚脲薄膜底层。研究了底层结构、聚乙二醇（PEG）终止前的末端基团密度和 PEG 表面覆盖率之间的关系。结果表明，在底层中使用三官能胺会增加 PEG 终止前的末端基团密度。此外，聚脲分子之间的氢键能力降低也有助于提高 PEG 的表面覆盖率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Japanese Journal of Applied Physics 物理-物理：应用

CiteScore

3.00

自引率

26.70%

发文量

818

审稿时长

3.5 months

期刊介绍： The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS