Compact on-chip dual-band bandpass filter with wide out-of-band suppression based on hybrid coupling technique

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2024-07-16 DOI:10.1016/j.mejo.2024.106304

引用次数: 0

Abstract

A compact dual-band bandpass ﬁlter (BPF) with wide out-of-band suppression based on a hybrid coupling technique is proposed. This BPF consists of two hybrid spiral coupled resonators, in which the electrical coupling and magnetic coupling between resonators can generate two transmission paths for dual bands. This dual-band BPF has wide out-of-band suppression. Moreover, its passband frequency and bandwidth can be readily controlled. To illustrate its working principle, an equivalent circuit with even- and odd-mode analysis is presented. This dual-band BPF is fabricated using a silicon integrated passive device (IPD) technology. The fabricated dual-band BPF has a compact size of 1.6 mm × 0.54 mm × 0.23 mm and is measured. The measured results show that this dual-band BPF can generate two bands at 2.45 GHz and 6.15 GHz. In addition, more than 20 dB of suppression is achieved from 7.8 to 20 GHz (8.16f₀). The simulated and measured results exhibit good agreements.

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基于混合耦合技术的带宽带外抑制紧凑型片上双频带通滤波器

本文提出了一种基于混合耦合技术、具有宽带外抑制功能的紧凑型双频带通滤波器（BPF）。该 BPF 由两个混合螺旋耦合谐振器组成，其中谐振器之间的电耦合和磁耦合可产生双频的两个传输路径。这种双频 BPF 具有很宽的带外抑制能力。此外，它的通带频率和带宽也可轻松控制。为了说明其工作原理，介绍了一个具有偶模和奇模分析的等效电路。该双频 BPF 采用硅集成无源器件（IPD）技术制造。所制作的双频 BPF 外形小巧，尺寸为 1.6 mm × 0.54 mm × 0.23 mm，并进行了测量。测量结果表明，这种双频 BPF 可以产生 2.45 GHz 和 6.15 GHz 两个频段。此外，在 7.8 至 20 GHz（8.16f0）范围内实现了超过 20 dB 的抑制。模拟和测量结果显示出良好的一致性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.