Jonh Yago Erikson Santos, Iago Lemos Dias, Ronaldo Lima Rezende, Givanilson Brito de Oliveira, Pedro Cardoso da Silva Neto, Fabiana Magalhães Teixeira Mendes, Roberto Hübler, Eduardo Kirinus Tentardini
{"title":"Influence of aluminum addition on structure, hardness, and oxidation resistance of Ta1−xAlxN thin films","authors":"Jonh Yago Erikson Santos, Iago Lemos Dias, Ronaldo Lima Rezende, Givanilson Brito de Oliveira, Pedro Cardoso da Silva Neto, Fabiana Magalhães Teixeira Mendes, Roberto Hübler, Eduardo Kirinus Tentardini","doi":"10.1002/sia.7343","DOIUrl":null,"url":null,"abstract":"Ta<jats:sub>1−x</jats:sub>Al<jats:sub>x</jats:sub>N thin films with 5, 15, and 40 at.% Al addition were co‐deposited by reactive magnetron sputtering and characterized by Rutherford backscattering spectroscopy (RBS), grazing angle X‐ray diffraction (GAXRD), X‐ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), nanohardness, and oxidation tests. GAXRD and XPS analyses showed, regardless of the % Al added, the non‐existence of ternary nitride Ta<jats:sub>1−x</jats:sub>Al<jats:sub>x</jats:sub>N, but always as individual binary nitrides, TaN and AlN. Sample TaAlN_15 obtained the highest hardness and H<jats:sup>3</jats:sup>/E<jats:sup>2</jats:sup> values, possibly due to the AlN grains presence, which were efficient in distorting the TaN lattice. All samples failed oxidation tests at 873 K, showing that the Al addition was not efficient in improving this property for tantalum aluminum nitride thin films.","PeriodicalId":22062,"journal":{"name":"Surface and Interface Analysis","volume":"6 1","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2024-07-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface and Interface Analysis","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.1002/sia.7343","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Ta1−xAlxN thin films with 5, 15, and 40 at.% Al addition were co‐deposited by reactive magnetron sputtering and characterized by Rutherford backscattering spectroscopy (RBS), grazing angle X‐ray diffraction (GAXRD), X‐ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), nanohardness, and oxidation tests. GAXRD and XPS analyses showed, regardless of the % Al added, the non‐existence of ternary nitride Ta1−xAlxN, but always as individual binary nitrides, TaN and AlN. Sample TaAlN_15 obtained the highest hardness and H3/E2 values, possibly due to the AlN grains presence, which were efficient in distorting the TaN lattice. All samples failed oxidation tests at 873 K, showing that the Al addition was not efficient in improving this property for tantalum aluminum nitride thin films.
期刊介绍:
Surface and Interface Analysis is devoted to the publication of papers dealing with the development and application of techniques for the characterization of surfaces, interfaces and thin films. Papers dealing with standardization and quantification are particularly welcome, and also those which deal with the application of these techniques to industrial problems. Papers dealing with the purely theoretical aspects of the technique will also be considered. Review articles will be published; prior consultation with one of the Editors is advised in these cases. Papers must clearly be of scientific value in the field and will be submitted to two independent referees. Contributions must be in English and must not have been published elsewhere, and authors must agree not to communicate the same material for publication to any other journal. Authors are invited to submit their papers for publication to John Watts (UK only), Jose Sanz (Rest of Europe), John T. Grant (all non-European countries, except Japan) or R. Shimizu (Japan only).