{"title":"A latent curing agent for rapid curing of phenolic epoxy resin at low temperature","authors":"Jian-Qiao Guo, Xing-Hong Zhang","doi":"10.1002/app.56003","DOIUrl":null,"url":null,"abstract":"<p>Developing effective latent curing agent for rapid curing of epoxy resins at low temperatures remains challenging. This study reports a latent curing agent, ortho-cresol phenolic epoxy resin-bisphenol A (EOCN-BPA), prepared through the addition reaction of o-methyl phenolic epoxy resin with BPA. When blended with dicyandiamide (DICY) in a 1:3 molar ratio, EOCN-BPA/DICY is used to cure a linear epoxy phenolic novolac (EPN) resin (epoxy equivalent: 550 g eq<sup>−1</sup>, softening point: approximately 82°C), at an onset curing temperature of 90°C, which is considerably lower than the onset curing temperature of DICY with EPN (160°C). However, EOCN-BPA does not react with EPN without a catalyst. Therefore, this latent curing system is successfully applied in powder coatings, rapid curing at 120°C within 3 min without an additional catalyst, outperforming the EPN/EOCN-BPA system using cocatalyst 2-methylimidazole. Consequently, DICY catalyzes the curing reaction between the phenol hydroxyl group and epoxy resin and participates in it. The prepared powder coating exhibits excellent storage stability, maintaining its properties for over 3 months at room temperature. These findings demonstrate the excellent latent properties of EOCN-BPA/DICY, highlighting its potential as a highly effective latent curing agent.</p>","PeriodicalId":183,"journal":{"name":"Journal of Applied Polymer Science","volume":"141 39","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-07-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Applied Polymer Science","FirstCategoryId":"92","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/app.56003","RegionNum":3,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Developing effective latent curing agent for rapid curing of epoxy resins at low temperatures remains challenging. This study reports a latent curing agent, ortho-cresol phenolic epoxy resin-bisphenol A (EOCN-BPA), prepared through the addition reaction of o-methyl phenolic epoxy resin with BPA. When blended with dicyandiamide (DICY) in a 1:3 molar ratio, EOCN-BPA/DICY is used to cure a linear epoxy phenolic novolac (EPN) resin (epoxy equivalent: 550 g eq−1, softening point: approximately 82°C), at an onset curing temperature of 90°C, which is considerably lower than the onset curing temperature of DICY with EPN (160°C). However, EOCN-BPA does not react with EPN without a catalyst. Therefore, this latent curing system is successfully applied in powder coatings, rapid curing at 120°C within 3 min without an additional catalyst, outperforming the EPN/EOCN-BPA system using cocatalyst 2-methylimidazole. Consequently, DICY catalyzes the curing reaction between the phenol hydroxyl group and epoxy resin and participates in it. The prepared powder coating exhibits excellent storage stability, maintaining its properties for over 3 months at room temperature. These findings demonstrate the excellent latent properties of EOCN-BPA/DICY, highlighting its potential as a highly effective latent curing agent.
期刊介绍:
The Journal of Applied Polymer Science is the largest peer-reviewed publication in polymers, #3 by total citations, and features results with real-world impact on membranes, polysaccharides, and much more.