Brian Parrott, Angelica Coronado Preciado, Eric Feron
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引用次数: 0
Abstract
The trade-off between resolution and speed represents a significant challenge when extrusion-based additive manufacturing (AM) is used for large-format additive manufacturing (LFAM). This paper presents an analysis of a new material extrusion process, named selective sheet extrusion (SSE), that aims to decouple these parameters. Unlike traditional single-nozzle material extrusion processes, SSE utilizes a single, very wide nozzle through which extrusion is controlled by an array of dynamically actuated teeth at the nozzle outlet. This allows the system to deposit a selectively structured sheet of material with each pass, potentially enabling the deposition of an entire layer of a part in a single pass. An analysis of the theoretical performance of the SSE technology, in terms of speed and material efficiency in comparison with single-nozzle extrusion systems, predicted speed increases of 2–3 times for the geometries that were explored. The analysis was then validated through experimental work that indicated a normalized improvement in print speed of between 2.3 and 2.5 times using a proof-of-concept SSE prototype. The SSE concept expands the opportunity frontier of LFAM technologies by enabling enhanced print speeds, while maintaining higher resolutions at scale. This enhancement in speed and/or resolution could have significant benefits, especially in large-scale prints that benefit from enhanced internal resolution.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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