Layer Contour Geometric Characterization in MEX/P through CIS-Based Adaptive Edge Detection

Alejandro Fernández, David Blanco, B. Álvarez, Pedro Fernández, P. Zapico, G. Valiño
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Abstract

The industrial adoption of material extrusion of polymers (MEX/P) is hindered by the geometric quality of manufactured parts. Contact image sensors (CISs), commonly used in flatbed scanners, have been proposed as a suitable technology for layer-wise characterization of contour deviations, paving the way for the application of corrective measures. Nevertheless, despite the high resolution of CIS digital images, the accurate characterization of layer contours in MEX/P is affected by contrast patterns between the layer and the background. Conventional edge-recognition algorithms struggle to comprehensively characterize layer contours, thereby diminishing the reliability of deviation measurements. In this work, we introduce a novel approach to precisely locate contour points in the context of MEX/P based on evaluating the similarity between the grayscale pattern near a particular tentative contour point and a previously defined gradient reference pattern. Initially, contrast patterns corresponding to various contour orientations and layer-to-background distances are captured. Subsequently, contour points are identified and located in the images, with coordinate measuring machine (CMM) verification serving as a ground truth. This information is then utilized by an adaptive edge-detection algorithm (AEDA) designed to identify boundaries in manufactured layers. The proposed method has been evaluated on test targets produced through MEX/P. The results indicate that the average deviation of point position compared to that achievable with a CMM in a metrology laboratory ranges from 8.02 µm to 13.11 µm within the experimental limits. This is a substantial improvement in the reliability of contour reconstruction when compared to previous research, and it could be crucial for implementing routines for the automated detection and correction of geometric deviations in AM parts.
通过基于 CIS 的自适应边缘检测在 MEX/P 中确定层轮廓几何特征
聚合物材料挤压技术(MEX/P)的工业应用受到制造部件几何质量的阻碍。平板扫描仪中常用的接触式图像传感器(CIS)被认为是一种适用于分层表征轮廓偏差的技术,为采取纠正措施铺平了道路。然而,尽管 CIS 数字图像具有高分辨率,但 MEX/P 图层轮廓的准确表征却受到图层与背景之间对比模式的影响。传统的边缘识别算法难以全面描述图层轮廓,从而降低了偏差测量的可靠性。在这项工作中,我们引入了一种新方法,通过评估特定暂定轮廓点附近的灰度模式与之前定义的梯度参考模式之间的相似性,在 MEX/P 的背景下精确定位轮廓点。首先,捕捉与各种轮廓方向和层到背景距离相对应的对比度模式。随后,在图像中识别和定位轮廓点,并通过坐标测量机(CMM)验证作为基本事实。自适应边缘检测算法 (AEDA) 将利用这些信息来识别制造层的边界。所提出的方法已在通过 MEX/P 生产的测试目标上进行了评估。结果表明,与计量实验室的坐标测量机相比,点位置的平均偏差在 8.02 微米到 13.11 微米之间,在实验范围内。与以前的研究相比,这大大提高了轮廓重建的可靠性,对于实施自动检测和修正 AM 零件几何偏差的程序至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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