S. Pondrelli, S. Salimbeni, J. Confal, M. Malusà, Anne Paul, Stephane Guillot, S. Solarino, E. Eva, C. Aubert, Liang Zhao
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Abstract
Abstract. There are still open questions about the deep structure beneath the Western Alps. Seismic velocity tomographies show the European slab subducting beneath the Adria plate, but all these images did not clarify completely the possible presence of tears, slab windows, or detachments. Seismic anisotropy, considered an indicator of mantle deformation and studied using data recorded by dense networks, allows a better understanding of mantle flows in terms of location and orientation at depth. Using the large amount of shear wave-splitting and splitting-intensity measurements available in the Western Alps, collected through the CIFALPS2 temporary seismic network, together with already available data, some new patterns can be highlighted, and gaps left by previous studies can be filled. Instead of the typical seismic anisotropy pattern parallel to the entire arc of the Western Alps, this study supports the presence of a differential contribution along the belt that is only partly related to the European slab steepening. A nearly north–south anisotropy pattern beneath the external Western Alps, a direction that cuts the morphological features of the belt, is clearly found with the new CIFALPS2 measurements. It is, however, confirmed that the asthenospheric flow from central France towards the Tyrrhenian Sea is turning around the southern tip of the European slab.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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