Dependence of frequency-temperature stability on support tethers in dual-beam piezoresistive sensing MEMS resonators

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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Abstract

This paper investigates the dependence of frequency stability over temperature on support tethers in dual-beam piezoresistive length-extensional (LE) mode microelectromechanical systems (MEMS) resonators. The designed dual-beam resonator consists of two identical single-crystal silicon beams, which are mechanically coupled and excited into vibrating in opposite phase to eliminate the inherent capacitive feedthrough signals. Both straight and folded beams are adopted as the support tethers for the reported dual-beam piezoresistive resonators. Quality factor (Q) and temperature distribution across the resonators with various support tethers are investigated by finite element method (FEM) analysis. It is found that folded beam tethers can reduce the support loss and hence improve the Q for the designed dual-beam resonator, while it comes with a tradeoff of high temperature rise on resonator body. The reported dual-beam resonator with straight beam tethers has low temperature rise on the resonator body, which is less sensitive to environmental temperature fluctuations, compared to its counterpart with folded beam tethers. Experimental results show that the fabricated dual-beam piezoresistive resonator with four straight beam tethers achieves a 0.5 ppm frequency shifts in the temperature-control chamber, which is nearly four times better than those with folded beam tethers.

Abstract Image

双束压阻传感 MEMS 谐振器中频率-温度稳定性与支撑系绳的关系
本文研究了双梁压阻长度-伸长(LE)模式微机电系统(MEMS)谐振器中频率稳定性随温度变化对支撑系绳的依赖性。所设计的双梁谐振器由两根相同的单晶硅梁组成,这两根梁通过机械耦合和激励以相反的相位振动,从而消除固有的电容馈通信号。报告中的双梁压阻谐振器采用了直梁和折叠梁作为支撑系杆。通过有限元法(FEM)分析研究了采用不同支撑缆绳的谐振器的品质因数(Q)和温度分布。研究发现,折叠梁缆线可减少支撑损耗,从而提高所设计双梁谐振器的 Q 值,但同时也会带来谐振器本体的高温升量。与采用折叠束带的双光束谐振器相比,采用直束带的双光束谐振器谐振器体的温升较低,对环境温度波动的敏感性较低。实验结果表明,带有四个直束系杆的双束压阻谐振器在温控室中实现了 0.5 ppm 的频率偏移,比带有折叠束系杆的谐振器好近四倍。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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