Yichuan Ran, Jiansong Sun, Renke Kang, Zhigang Dong, Yan Bao
{"title":"Towards understanding the machining process in grinding of ceramic matrix composites: A review","authors":"Yichuan Ran, Jiansong Sun, Renke Kang, Zhigang Dong, Yan Bao","doi":"10.1016/j.compositesb.2024.111657","DOIUrl":null,"url":null,"abstract":"<div><p>The challenge of machining ceramic matrix composites (CMCs) arises from their hard and brittle, anisotropic, and heterogeneous nature, making them prone to damage such as edge chipping, fiber fracture, and interfacial debonding during grinding. To gain a thorough understanding of CMCs' grinding performance, this paper discusses in detail the removal behavior under the action of abrasive grain, focusing on the micro-interaction of abrasive grain and material. Following this analysis, various strategies for modeling grinding forces are elaborated. Then, we outline the quality evaluation of CMCs and offer solutions to mitigate grinding damage by comprehensively assessing the factors affecting material removal in CMCs. Ultimately, the prospects and potential advancements in the application of grinding processes for CMCs are highlighted.</p></div>","PeriodicalId":10660,"journal":{"name":"Composites Part B: Engineering","volume":"284 ","pages":"Article 111657"},"PeriodicalIF":14.2000,"publicationDate":"2024-07-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Part B: Engineering","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1359836824004694","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The challenge of machining ceramic matrix composites (CMCs) arises from their hard and brittle, anisotropic, and heterogeneous nature, making them prone to damage such as edge chipping, fiber fracture, and interfacial debonding during grinding. To gain a thorough understanding of CMCs' grinding performance, this paper discusses in detail the removal behavior under the action of abrasive grain, focusing on the micro-interaction of abrasive grain and material. Following this analysis, various strategies for modeling grinding forces are elaborated. Then, we outline the quality evaluation of CMCs and offer solutions to mitigate grinding damage by comprehensively assessing the factors affecting material removal in CMCs. Ultimately, the prospects and potential advancements in the application of grinding processes for CMCs are highlighted.
期刊介绍：
Composites Part B: Engineering is a journal that publishes impactful research of high quality on composite materials. This research is supported by fundamental mechanics and materials science and engineering approaches. The targeted research can cover a wide range of length scales, ranging from nano to micro and meso, and even to the full product and structure level. The journal specifically focuses on engineering applications that involve high performance composites. These applications can range from low volume and high cost to high volume and low cost composite development.
The main goal of the journal is to provide a platform for the prompt publication of original and high quality research. The emphasis is on design, development, modeling, validation, and manufacturing of engineering details and concepts. The journal welcomes both basic research papers and proposals for review articles. Authors are encouraged to address challenges across various application areas. These areas include, but are not limited to, aerospace, automotive, and other surface transportation. The journal also covers energy-related applications, with a focus on renewable energy. Other application areas include infrastructure, off-shore and maritime projects, health care technology, and recreational products.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
