Xin Si;Fangyuan Dong;Shengnan He;Yuhui Shi;Anran Yin;Hui Gao;Xiang Li
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引用次数: 0
Abstract
Conventional digital-domain SRAM compute-in-memory (CIM) faces challenges in handling multiply-and-accumulate (MAC) operations with signed values, either in serial data feeding mode or extra sign-bit processing. The proposed CIM macro has the following features: 1) a sign-extension-less array multiplication circuit structure that eliminates the need for converting partial sums into 2’s complement, which removes the constraints related to handling specific symbol bits; 2) developing a circuit that avoids signed bit extension shift and accumulate, resulting in reduced area cost; and 3) integrating an adder structure that provides adjustable accuracy, thereby enhancing network adaptability as compared to traditional approximation techniques. A fabricated 28 nm 16-kb sign-extension-less DCIM was tested with the highest MAC speed with 5.6 ns (Signed 8 b IN&W 23 b Out) and achieved the best energy efficiency with 40.15 TOPS/W over a wide range of network adaptability.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.