Deposition of a polymer thin film on a silver surface for surface plasmon sensing

IF 1.5 4区物理与天体物理 Q3 PHYSICS, APPLIED

Japanese Journal of Applied Physics Pub Date : 2024-06-23 DOI:10.35848/1347-4065/ad523f

Akinari Abe, Ipsita Chakraborty, Daiki Matsubayashi, Tsuyoshi Noguchi, Akitoshi Okino and Hiroshi Kano

引用次数: 0

Abstract

We report a deposition method of a polymer thin film on the silver surface of a surface plasmon sensor for preventing sensitivity degradation in refractive index measurements due to the poor chemical stability of the silver. The deposition of a poly(methyl methacrylate) thin film with a ∼15 nm thickness was conducted by employing a spin coating technique along with a hydrophilicity enhancement of the silver surface using an atmospheric low-temperature plasma treatment. We experimentally verified the thickness by measuring the propagation constant of the surface plasmon. The measured propagation constants that showed the standard deviation at the order of 10−4 indicated microscopical uniformity. Furthermore, the reproducibility of thickness was experimentally verified.

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在银表面沉积用于表面等离子传感的聚合物薄膜

我们报告了一种在表面等离子体传感器的银表面沉积聚合物薄膜的方法，以防止由于银的化学稳定性差而导致折射率测量灵敏度下降。我们采用旋涂技术在银表面沉积了厚度为 15 纳米的聚甲基丙烯酸甲酯薄膜，并通过大气低温等离子体处理增强了银表面的亲水性。我们通过测量表面等离子体的传播常数来验证厚度。测量到的传播常数的标准偏差在 10-4 数量级，这表明了微观均匀性。此外，厚度的再现性也得到了实验验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Japanese Journal of Applied Physics 物理-物理：应用

CiteScore

3.00

自引率

26.70%

发文量

818

审稿时长

3.5 months

期刊介绍： The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP). JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields: • Semiconductors, dielectrics, and organic materials • Photonics, quantum electronics, optics, and spectroscopy • Spintronics, superconductivity, and strongly correlated materials • Device physics including quantum information processing • Physics-based circuits and systems • Nanoscale science and technology • Crystal growth, surfaces, interfaces, thin films, and bulk materials • Plasmas, applied atomic and molecular physics, and applied nuclear physics • Device processing, fabrication and measurement technologies, and instrumentation • Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS