Microstructure and mechanical properties of Al2O3 ceramic and copper joints brazed with AgCuInTi brazing alloy

IF 1.8 4区 材料科学 Q2 MATERIALS SCIENCE, CERAMICS
Botao Li, Ben Liu, Yong Wang, Ruoqi Hu, Ying Wang, Zhenwen Yang
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Abstract

Reliable metallurgical bonding between Al2O3 ceramic and copper was achieved by vacuum brazing using Ag–23Cu–14.5In–3.3Ti (wt.%) alloy. The representative interfacial structure of the joint was Al2O3/Ti3(Cu,Al)3O + γ-TiO/Ag-based solid solution + (Cu,Ag)7In3 + Ag–Cu eutectic + Cu-based solid solution/copper. The interface microstructure evolved with process parameters, including the formation of γ-TiO and Ti3(Cu,Al)3O, as evidenced by microstructural analysis and etched surface morphology. The relationship between fracture path and shear strength was established by observing the fracture morphology and performing shear strength tests on joints with various process parameters, utilizing the degree of the Ag-based solid solution loss and the thickness of the reaction layer as evaluative factors. When brazed at 760 or 780°C for 20 min using a 100 µm brazing alloy foil, the brazed joints demonstrated a peak shear strength of 215 ± 25 MPa, and the fracture predominantly occurred in the Al2O3 matrix and Ti3(Cu,Al)3O layer.

用 AgCuInTi 铜焊合金钎焊的 Al2O3 陶瓷和铜接头的微观结构和机械性能
通过使用 Ag-23Cu-14.5In-3.3Ti (wt.%) 合金进行真空钎焊,实现了 Al2O3 陶瓷与铜之间可靠的冶金结合。接头的代表性界面结构为 Al2O3/Ti3(Cu,Al)3O + γ-TiO/Ag 基固溶体 + (Cu,Ag)7In3 + Ag-Cu 共晶 + Cu 基固溶体/铜。界面微观结构随工艺参数变化,包括γ-TiO和Ti3(Cu,Al)3O的形成,微观结构分析和蚀刻表面形态证明了这一点。通过观察断口形态,并利用银基固溶体流失程度和反应层厚度作为评估因素,对具有不同工艺参数的接头进行剪切强度测试,从而确定了断口路径与剪切强度之间的关系。当使用 100 µm 的钎焊合金箔在 760 或 780°C 下钎焊 20 分钟时,钎焊接头的峰值剪切强度为 215 ± 25 MPa,断裂主要发生在 Al2O3 基体和 Ti3(Cu,Al)3O 层。
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来源期刊
International Journal of Applied Ceramic Technology
International Journal of Applied Ceramic Technology 工程技术-材料科学:硅酸盐
CiteScore
3.90
自引率
9.50%
发文量
280
审稿时长
4.5 months
期刊介绍: The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas: Nanotechnology applications; Ceramic Armor; Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors); Ceramic Matrix Composites; Functional Materials; Thermal and Environmental Barrier Coatings; Bioceramic Applications; Green Manufacturing; Ceramic Processing; Glass Technology; Fiber optics; Ceramics in Environmental Applications; Ceramics in Electronic, Photonic and Magnetic Applications;
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