A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms

Abstract

Solder joint, crucial component in electronic systems, face significant challenges when exposed to extreme conditions during applications. The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions. Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint. This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions. This study covers an in-depth analysis of effect extreme temperature, mechanical stress, and radiation conditions towards solder joint. Impact of each condition to the microstructure including solder matrix and intermetallic compound layer, and mechanical properties such as fatigue, shear strength, creep, and hardness was thoroughly discussed. The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding. Furthermore, the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions. The findings offer valuable guidance for researchers, engineers, and practitioners involved in electronics, engineering, and related fields, fostering advancements in solder joint reliability and performance.