{"title":"A chip inspection system based on a multiscale subarea attention network","authors":"Yun Hou, Hong Fan, Ying Chen, Guangshuai Liu","doi":"10.1007/s10845-024-02441-z","DOIUrl":null,"url":null,"abstract":"<p>Cavities in a weld seriously affect the airtightness of the chip, which makes chip inspection a crucial step in intelligent manufacturing. In recent years, deep learning-based defect inspection models have shown significant advantages in reducing human errors. However, due to the scarcity of defective data, deep learning-based models are susceptible to overfitting. Moreover, the multiscale and uneven grayscale distribution of cavities further compound the challenges faced by these models. To address these issues, we develop a chip inspection system based on a multiscale subarea attention network (MSANet) for cavity defect detection. In the system, the segment anything model is embedded to interactively segment the weld. Furthermore, to circumvent the overfitting problem, a large-scale cavity dataset is built by splitting the segmented weld into multiple patches. Notably, a novel MSANet is proposed to precisely segment the varying cavities, and a source-to-destination Dijkstra algorithm is designed to assess the chip quality. The experimental results demonstrate that our chip inspection system achieves a 99.24% F1-score and 99.26% AUC.</p>","PeriodicalId":16193,"journal":{"name":"Journal of Intelligent Manufacturing","volume":"12 1","pages":""},"PeriodicalIF":5.9000,"publicationDate":"2024-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Intelligent Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s10845-024-02441-z","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE","Score":null,"Total":0}
引用次数: 0
Abstract
Cavities in a weld seriously affect the airtightness of the chip, which makes chip inspection a crucial step in intelligent manufacturing. In recent years, deep learning-based defect inspection models have shown significant advantages in reducing human errors. However, due to the scarcity of defective data, deep learning-based models are susceptible to overfitting. Moreover, the multiscale and uneven grayscale distribution of cavities further compound the challenges faced by these models. To address these issues, we develop a chip inspection system based on a multiscale subarea attention network (MSANet) for cavity defect detection. In the system, the segment anything model is embedded to interactively segment the weld. Furthermore, to circumvent the overfitting problem, a large-scale cavity dataset is built by splitting the segmented weld into multiple patches. Notably, a novel MSANet is proposed to precisely segment the varying cavities, and a source-to-destination Dijkstra algorithm is designed to assess the chip quality. The experimental results demonstrate that our chip inspection system achieves a 99.24% F1-score and 99.26% AUC.
期刊介绍:
The Journal of Nonlinear Engineering aims to be a platform for sharing original research results in theoretical, experimental, practical, and applied nonlinear phenomena within engineering. It serves as a forum to exchange ideas and applications of nonlinear problems across various engineering disciplines. Articles are considered for publication if they explore nonlinearities in engineering systems, offering realistic mathematical modeling, utilizing nonlinearity for new designs, stabilizing systems, understanding system behavior through nonlinearity, optimizing systems based on nonlinear interactions, and developing algorithms to harness and leverage nonlinear elements.