{"title":"Compression creep behaviors of GH4169 cylinder entangled wire material at elevated temperatures","authors":"Fuqiang Lai, Guilin Gao, Congjian Zhou, Yiwan Wu, Xin Xue","doi":"10.1016/j.matlet.2024.136904","DOIUrl":null,"url":null,"abstract":"<div><p>As a nickel-based alloy, GH4169 has the properties of excellent corrosion resistance, high temperature oxidation resistance and high creep resistance. In this paper, the compression creep behaviors of cylinder entangled wire materials (CEWMs) made from metal wires (GH4169 nickel-based alloy, 304 stainless steel) were investigated at elevated temperatures (from 400 °C to 500 °C). The performance degradation of the two materials was evaluated by the variation amplitude of four mechanical properties parameters and material characterization methods. The results indicated that both of 304 CEWMs and GH4169 CEWMs suffered a significant performance degradation at elevated temperatures, and both of the two CEWMs showed a much serious performance degradation above 450 °C (tempering temperature). Compared to the 304 CEWMs at the tested temperatures, the GH4169 CEWMs obtained better creep resistance. It is therefore concluded that the GH4169 CEWM is an excellent material that can replace the commonly used 304 CEWM at elevated temperature work conditions.</p></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":null,"pages":null},"PeriodicalIF":2.7000,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24010437","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
As a nickel-based alloy, GH4169 has the properties of excellent corrosion resistance, high temperature oxidation resistance and high creep resistance. In this paper, the compression creep behaviors of cylinder entangled wire materials (CEWMs) made from metal wires (GH4169 nickel-based alloy, 304 stainless steel) were investigated at elevated temperatures (from 400 °C to 500 °C). The performance degradation of the two materials was evaluated by the variation amplitude of four mechanical properties parameters and material characterization methods. The results indicated that both of 304 CEWMs and GH4169 CEWMs suffered a significant performance degradation at elevated temperatures, and both of the two CEWMs showed a much serious performance degradation above 450 °C (tempering temperature). Compared to the 304 CEWMs at the tested temperatures, the GH4169 CEWMs obtained better creep resistance. It is therefore concluded that the GH4169 CEWM is an excellent material that can replace the commonly used 304 CEWM at elevated temperature work conditions.
期刊介绍:
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive