Optimizing MMIC performance: The synergy of AI models and heterogeneous integration process

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jie Liu, Jiayu Chen, Yifan Wu, Guodong Su, Junchao Wang, Yuehang Xu, Jun Liu
{"title":"Optimizing MMIC performance: The synergy of AI models and heterogeneous integration process","authors":"Jie Liu,&nbsp;Jiayu Chen,&nbsp;Yifan Wu,&nbsp;Guodong Su,&nbsp;Junchao Wang,&nbsp;Yuehang Xu,&nbsp;Jun Liu","doi":"10.1002/jnm.3247","DOIUrl":null,"url":null,"abstract":"<p>This study presents a novel approach for optimizing the parameters of monolithic microwave integrated circuit (MMIC) functional units using machine-learning techniques and multi-objective optimization algorithms. We utilize advanced machine-learning methods, including random forest, artificial neural networks (ANNs), and recurrent neural networks (RNNs), to construct highly accurate models that predict the performance of these units. These models are subsequently integrated with a multi-objective optimization algorithm, specifically the multi-objective particle swarm optimization (MOPSO), to generate inverse design solutions for both the geometric designs of the units and the fabrication parameters of the heterogeneous integration process. Our approach, which has been validated through chip fabrication and testing, has demonstrated its robustness as a tool for achieving optimal MMIC designs. It not only reduces the design time but also enhances the manufacturability of MMICs, thereby opening new avenues in microwave and RF circuit design.</p>","PeriodicalId":50300,"journal":{"name":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","volume":"37 3","pages":""},"PeriodicalIF":1.6000,"publicationDate":"2024-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Numerical Modelling-Electronic Networks Devices and Fields","FirstCategoryId":"5","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/jnm.3247","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

This study presents a novel approach for optimizing the parameters of monolithic microwave integrated circuit (MMIC) functional units using machine-learning techniques and multi-objective optimization algorithms. We utilize advanced machine-learning methods, including random forest, artificial neural networks (ANNs), and recurrent neural networks (RNNs), to construct highly accurate models that predict the performance of these units. These models are subsequently integrated with a multi-objective optimization algorithm, specifically the multi-objective particle swarm optimization (MOPSO), to generate inverse design solutions for both the geometric designs of the units and the fabrication parameters of the heterogeneous integration process. Our approach, which has been validated through chip fabrication and testing, has demonstrated its robustness as a tool for achieving optimal MMIC designs. It not only reduces the design time but also enhances the manufacturability of MMICs, thereby opening new avenues in microwave and RF circuit design.

优化 MMIC 性能:人工智能模型与异质集成工艺的协同作用
本研究提出了一种利用机器学习技术和多目标优化算法优化单片微波集成电路(MMIC)功能单元参数的新方法。我们利用先进的机器学习方法,包括随机森林、人工神经网络 (ANN) 和递归神经网络 (RNN),构建了预测这些单元性能的高精度模型。随后,将这些模型与多目标优化算法(特别是多目标粒子群优化 (MOPSO))相结合,为单元的几何设计和异质集成过程的制造参数生成反向设计解决方案。我们的方法已通过芯片制造和测试验证,证明了其作为实现最佳 MMIC 设计工具的稳健性。它不仅缩短了设计时间,还提高了 MMIC 的可制造性,从而为微波和射频电路设计开辟了新途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
4.60
自引率
6.20%
发文量
101
审稿时长
>12 weeks
期刊介绍: Prediction through modelling forms the basis of engineering design. The computational power at the fingertips of the professional engineer is increasing enormously and techniques for computer simulation are changing rapidly. Engineers need models which relate to their design area and which are adaptable to new design concepts. They also need efficient and friendly ways of presenting, viewing and transmitting the data associated with their models. The International Journal of Numerical Modelling: Electronic Networks, Devices and Fields provides a communication vehicle for numerical modelling methods and data preparation methods associated with electrical and electronic circuits and fields. It concentrates on numerical modelling rather than abstract numerical mathematics. Contributions on numerical modelling will cover the entire subject of electrical and electronic engineering. They will range from electrical distribution networks to integrated circuits on VLSI design, and from static electric and magnetic fields through microwaves to optical design. They will also include the use of electrical networks as a modelling medium.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信