Impact of Immunosuppressive Therapy on Lead Dislodgement After Cardiac Implantable Electronic Device Implantation

IF 4.6 Q2 MATERIALS SCIENCE, BIOMATERIALS
Yasuhiro Matsuda, Masaharu Masuda, Mitsutoshi Asai, Shin Okamoto, Takayuki Ishihara, Kiyonori Nanto, Takuya Tsujimura, Yosuke Hata, Hiroyuki Uematsu, Naoko Higashino, Sho Nakao, Masaya Kusuda, Toshiaki Mano
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引用次数: 0

Abstract

Backgrounds

Lead dislodgement is a severe complication in cardiac implantable electronic device (CIED) implantation. Inflammation after CIED implantation results in the development of adhesions between lead and tissues, resulting in the lead becoming fixed in the body. In patients with immunosuppressive therapy, however, adhesion is inhibited by anti-inflammatory effects. However, the association between lead dislodgement and immunosuppressive therapy has not been clarified. The purpose of this study was to investigate the association between lead dislodgement and immunosuppressive therapy.

Hypothesis

We hypothesized that lead dislodgement more frequently occur in patients with immunosuppressive therapy than those without.

Methods

In total, 651 consecutive patients who underwent CIED implantation or lead addition (age, 76 ± 11 years; and males, 374 [58%], high voltage device, 121 [19%], lead addition 23 [4%]) were retrospectively enrolled. Immunosuppressive therapy was with regular steroids or immunosuppressants. Lead placement was guided by fluoroscopy, and active fixation leads were used. Restraint of the upper limb by chest tape was performed for 1 week after the procedure. Lead dislodgement was defined as a change in lead position and/or lead failure requiring reoperation.

Results

Twenty (3.1%) patients received immunosuppressive therapy. Among these, 15 (2.3%) patients regularly took steroids and 8 (1.2%) took immunosuppressants. Lead dislodgement occurred in 10 (1.5%) patients. Lead dislodgement was more frequent in patients with immunosuppressive therapy than in those without (3 [15%] vs. 7 [1%], p = 0.003).

Conclusion

In patients with CIED implantation or lead addition, lead dislodgement is more frequent in patients with immunosuppressive therapy than in those without.

Abstract Image

免疫抑制疗法对心脏植入式电子设备植入术后引线脱落的影响
背景:导线脱落是心脏植入式电子装置(CIED)植入过程中的一种严重并发症。植入 CIED 后的炎症会导致导线与组织之间产生粘连,从而使导线固定在体内。不过,在接受免疫抑制治疗的患者中,粘连会因抗炎作用而受到抑制。然而,铅脱落与免疫抑制治疗之间的关系尚未明确。本研究旨在探讨铅脱落与免疫抑制治疗之间的关联:我们假设,与未接受免疫抑制治疗的患者相比,接受免疫抑制治疗的患者更容易发生导线脱落:我们回顾性地纳入了 651 名接受 CIED 植入或导联添加的连续患者(年龄 76 ± 11 岁;男性 374 [58%],高压装置 121 [19%],导联添加 23 [4%])。免疫抑制治疗采用常规类固醇或免疫抑制剂。导联放置由透视引导,并使用主动固定导联。术后用胸带固定上肢一周。导联脱落定义为导联位置改变和/或导联失效,需要再次手术:20例(3.1%)患者接受了免疫抑制治疗。其中,15 名患者(2.3%)定期服用类固醇,8 名患者(1.2%)服用免疫抑制剂。10例(1.5%)患者发生了铅脱落。与未接受免疫抑制治疗的患者相比,接受免疫抑制治疗的患者发生导线脱落的频率更高(3 [15%] vs. 7 [1%],P = 0.003):结论:在植入 CIED 或增加导联的患者中,接受免疫抑制治疗的患者比未接受免疫抑制治疗的患者更容易发生导联脱落。
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来源期刊
ACS Applied Bio Materials
ACS Applied Bio Materials Chemistry-Chemistry (all)
CiteScore
9.40
自引率
2.10%
发文量
464
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