Performance analysis of four-stage thermoelectric cooler for focal plane infrared detectors

Abstract

A cooler provides a low-temperature working environment for refrigerated infrared detection chips and is an indispensable component in infrared detectors that ensures their smooth operation. In this paper, a thermodynamic model of a heat-pipe-type four-stage thermoelectric cooler with a large temperature difference applied to a focal plane infrared detector is constructed. The heat leakage of the detector is calculated using the model. The performance indexes of the coordination performance coefficient and module utilization coefficient are used to unify the cooling capacity and economic performance of the device. The impression of the working current, heat pipe parameters, and cross-sectional area of the thermoelectric leg on the performance of cooler are analyzed. A Pareto optimal solution is obtained using an NSGA-II algorithm and TOPSIS decision. A low cooling temperature is obtained using a multistage thermoelectric cooler to achieve a large cooling temperature difference. When the working current is 5.65 A and the cross-sectional area is 4.5 mm², the maximum cooling temperature difference reaches 110.6 °C, and the lowest cooling temperature reaches -83.6 °C. When the working temperature of the detector is -60 °C, the current and cross-sectional area corresponding to the optimal solution of cooling capacity-COP-power consumption are 1.51 A and 2.74 mm², respectively.