Research on the influence of random stiffness of the rubber tie plate on the coupled vehicle-turnout system based on the probability density evolution method

IF 4.3 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

ACS Applied Electronic Materials Pub Date : 2024-06-05 DOI:10.1080/00423114.2024.2353701

Zheng Yan, Zhiheng Li, Jing-mang Xu, Kailai Xiang, Jiayin Chen, Ping Wang, Yao Qian, Fei Yang

引用次数: 0

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基于概率密度演化法的橡胶拉杆板随机刚度对车辆-道岔耦合系统影响的研究

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico