A Novel Contact Stiffness Model for Grinding Joint Surface Based on the Generalized Ubiquitiformal Sierpinski Carpet Theory

IF 4.3 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

ACS Applied Electronic Materials Pub Date : 2024-06-12 DOI:10.3390/fractalfract8060351

Qi An, Yue Liu, Min Huang, Shuangfu Suo

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引用次数: 0

Abstract

A novel analytical model based on the generalized ubiquitiformal Sierpinski carpet is proposed which can more accurately obtain the normal contact stiffness of the grinding joint surface. Firstly, the profile and the distribution of asperities on the grinding surface are characterized. Then, based on the generalized ubiquitiformal Sierpinski carpet, the contact characterization of the grinding joint surface is realized. Secondly, a contact mechanics analysis of the asperities on the grinding surface is carried out. The analytical expressions for contact stiffness in various deformation stages are derived, culminating in the establishment of a comprehensive analytical model for the grinding joint surface. Subsequently, a comparative analysis is conducted between the outcomes of the presented model, the KE model, and experimental data. The findings reveal that, under identical contact pressure conditions, the results obtained from the presented model exhibit a closer alignment with experimental observations compared to the KE model. With an increase in contact pressure, the relative error of the presented model shows a trend of first increasing and then decreasing, while the KE model has a trend of increasing. For the relative error values of the four surfaces under different contact pressures, the maximum relative error of the presented model is 5.44%, while the KE model is 22.99%. The presented model can lay a solid theoretical foundation for the optimization design of high-precision machine tools and provide a scientific theoretical basis for the performance analysis of machine tool systems.

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基于广义泛位西尔平斯基地毯理论的磨削接头表面接触刚度新模型

本文提出了一种基于广义泛形 Sierpinski 地毯的新型分析模型，该模型可以更准确地获得磨削接头表面的法向接触刚度。首先，对磨削表面上的粗糙度轮廓和分布进行了表征。然后，基于广义泛形西尔品斯基地毯，实现磨削接头表面的接触表征。其次，对磨削表面上的微孔进行了接触力学分析。推导出不同变形阶段接触刚度的分析表达式，最终建立了磨削接头表面的综合分析模型。随后，对所提出模型的结果、KE 模型和实验数据进行了对比分析。研究结果表明，在相同的接触压力条件下，与 KE 模型相比，所提出的模型得出的结果与实验观察结果更接近。随着接触压力的增加，提出的模型的相对误差呈现先增大后减小的趋势，而 KE 模型则呈现增大的趋势。对于不同接触压力下四个表面的相对误差值，提出的模型的最大相对误差为 5.44%，而 KE 模型为 22.99%。该模型可为高精度机床的优化设计奠定坚实的理论基础，并为机床系统的性能分析提供科学的理论依据。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico