{"title":"A review on the development of ceria for chemical mechanical polishing","authors":"Jiahui Ma , Ning Xu , Jie Cheng , Yongping Pu","doi":"10.1016/j.powtec.2024.119989","DOIUrl":null,"url":null,"abstract":"<div><p>Chemical mechanical polishing (CMP) is widely used as an ultra-precision machining technology, which determines the final fabrication accuracy of the device. CeO<sub>2</sub> abrasives exhibit excellent CMP performance due to the unique chemical and mechanical properties. With the increasing demand of planarization, how to improve the polishing efficiency of CeO<sub>2</sub> abrasives in the CMP has become one of the hotspots. Over the past decades, extensive efforts have been devoted to develop the CeO<sub>2</sub> abrasives for CMP and great progress has been obtained. Here, we present an overview on the research of CeO<sub>2</sub> abrasives for CMP. This review starts with a brief introduction the research background and related basic concepts of CMP technology and ceria. Emphasis is placed on the development of CeO<sub>2</sub> abrasives, assisted polishing, CMP mechanism, post-CMP cleaning and computational chemistry. Finally, the future development trend of CeO<sub>2</sub> abrasives and the issues that need to be solved are prospected.</p></div>","PeriodicalId":407,"journal":{"name":"Powder Technology","volume":null,"pages":null},"PeriodicalIF":4.5000,"publicationDate":"2024-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Powder Technology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032591024006326","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Chemical mechanical polishing (CMP) is widely used as an ultra-precision machining technology, which determines the final fabrication accuracy of the device. CeO2 abrasives exhibit excellent CMP performance due to the unique chemical and mechanical properties. With the increasing demand of planarization, how to improve the polishing efficiency of CeO2 abrasives in the CMP has become one of the hotspots. Over the past decades, extensive efforts have been devoted to develop the CeO2 abrasives for CMP and great progress has been obtained. Here, we present an overview on the research of CeO2 abrasives for CMP. This review starts with a brief introduction the research background and related basic concepts of CMP technology and ceria. Emphasis is placed on the development of CeO2 abrasives, assisted polishing, CMP mechanism, post-CMP cleaning and computational chemistry. Finally, the future development trend of CeO2 abrasives and the issues that need to be solved are prospected.
期刊介绍：
Powder Technology is an International Journal on the Science and Technology of Wet and Dry Particulate Systems. Powder Technology publishes papers on all aspects of the formation of particles and their characterisation and on the study of systems containing particulate solids. No limitation is imposed on the size of the particles, which may range from nanometre scale, as in pigments or aerosols, to that of mined or quarried materials. The following list of topics is not intended to be comprehensive, but rather to indicate typical subjects which fall within the scope of the journal's interests:
Formation and synthesis of particles by precipitation and other methods.
Modification of particles by agglomeration, coating, comminution and attrition.
Characterisation of the size, shape, surface area, pore structure and strength of particles and agglomerates (including the origins and effects of inter particle forces).
Packing, failure, flow and permeability of assemblies of particles.
Particle-particle interactions and suspension rheology.
Handling and processing operations such as slurry flow, fluidization, pneumatic conveying.
Interactions between particles and their environment, including delivery of particulate products to the body.
Applications of particle technology in production of pharmaceuticals, chemicals, foods, pigments, structural, and functional materials and in environmental and energy related matters.
For materials-oriented contributions we are looking for articles revealing the effect of particle/powder characteristics (size, morphology and composition, in that order) on material performance or functionality and, ideally, comparison to any industrial standard.
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