Qinqin He , Yixin Xu , Haidong Wang , Zhigang Li , Yanguang Zhou
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引用次数: 0
Abstract
The interfaces between SiC and the corresponding substrate largely affect the performance of SiC-based electronics. Understanding and designing the interfacial thermal transport across the SiC/substrate interfaces is critical for the thermal management design of these SiC-based power electronics. In this work, we systematically investigate the heat transfer across the 3C-SiC/Si, 4H-SiC/Si, and 6H-SiC/Si interfaces using non-equilibrium molecular dynamics simulations and diffuse mismatch model. We find that the room temperature ITC for 3C-SiC/Si, 4H-SiC/Si, and 6H-SiC/Si interfaces is 932 MW/m2K, 759 MW/m2K, and 697 MW/m2K, respectively, which is among the highest values for all interfaces made up of semiconductors (Yue et al., 2011; Cheng et al., 2020; Wilson et al., 2015; Ziade et al., 2015) [[1], [2], [3], [4]]. The ultrahigh ITC of SiC/Si heterointerfaces at room temperature and high temperatures results from the dictating elastic scatterings at interfaces. We further find the ITC contributed by the elastic scattering decreases with the temperature but remains at a high ratio of 67%-78% even at an ultrahigh temperature of 1000 K. The reason for such a high elastic ITC is the large overlap between the vibrational density of states of Si and SiC at low and middle frequencies (<∼18 THz), which is also demonstrated by the diffuse mismatch model.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.