Phonon and Thermal Properties of Silicon Carbide: A Comparison of Empirical and Machine Learning Potentials

Jian Zhang, Haochun Zhang, Yuan Zhang, Xikui Ma, Weifeng Li, Gang Zhang
{"title":"Phonon and Thermal Properties of Silicon Carbide: A Comparison of Empirical and Machine Learning Potentials","authors":"Jian Zhang, Haochun Zhang, Yuan Zhang, Xikui Ma, Weifeng Li, Gang Zhang","doi":"10.1002/pssb.202400070","DOIUrl":null,"url":null,"abstract":"Silicon carbide (SiC), as a third‐generation semiconductor material, has attracted significant research attention. Various empirical potentials and machine learning potentials have been developed, but there are few comparative studies on phonon and thermal properties. Herein, the Tersoff and Vashishta empirical potentials, as well as the Bayesian force field constructed by the FLARE framework using principled Gaussian process uncertainties (FLARE BFF), for a comparative study, are selected. The phonon dispersion relation, phonon density of states, Grüneisen constants, and the average phonon‐weighted Grüneisen constants are calculated using different potentials, and it is found that the FLARE BFF potential has the highest accuracy with respect to the first‐principles calculations. Furthermore, the thermal conductivity using molecular dynamics simulation with different potentials is calculated. The calculation results using the FLARE BFF potential closely match the experimental reports at high temperature, but the longest computing time is required. This study can facilitate the understanding of thermal properties of SiC.","PeriodicalId":20107,"journal":{"name":"physica status solidi (b)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"physica status solidi (b)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1002/pssb.202400070","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Silicon carbide (SiC), as a third‐generation semiconductor material, has attracted significant research attention. Various empirical potentials and machine learning potentials have been developed, but there are few comparative studies on phonon and thermal properties. Herein, the Tersoff and Vashishta empirical potentials, as well as the Bayesian force field constructed by the FLARE framework using principled Gaussian process uncertainties (FLARE BFF), for a comparative study, are selected. The phonon dispersion relation, phonon density of states, Grüneisen constants, and the average phonon‐weighted Grüneisen constants are calculated using different potentials, and it is found that the FLARE BFF potential has the highest accuracy with respect to the first‐principles calculations. Furthermore, the thermal conductivity using molecular dynamics simulation with different potentials is calculated. The calculation results using the FLARE BFF potential closely match the experimental reports at high temperature, but the longest computing time is required. This study can facilitate the understanding of thermal properties of SiC.
碳化硅的声子和热特性:经验与机器学习潜力的比较
碳化硅(SiC)作为第三代半导体材料,已经吸引了大量研究人员的关注。目前已开发出多种经验势和机器学习势,但有关声子和热特性的比较研究却很少。本文选择了 Tersoff 和 Vashishta 经验势以及 FLARE 框架利用原则性高斯过程不确定性构建的贝叶斯力场(FLARE BFF)进行比较研究。利用不同的势计算了声子色散关系、声子状态密度、格吕内森常数和平均声子加权格吕内森常数,结果发现 FLARE BFF 势相对于第一原理计算具有最高的精度。此外,还利用分子动力学模拟计算了不同电位的热导率。使用 FLARE BFF 电位的计算结果与高温下的实验报告非常接近,但所需的计算时间最长。这项研究有助于了解碳化硅的热特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信