{"title":"Co-Optimization of Test Wrapper Length and TSV for TSV Based 3D SOCs","authors":"Tanusree Kaibartta, G. P. Biswas, D. K. Das","doi":"10.1007/s10836-020-05872-7","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":501485,"journal":{"name":"Journal of Electronic Testing","volume":" 970","pages":"239 - 253"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Testing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/s10836-020-05872-7","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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