3D constructions of coupled strip lines and their application in microwave devices (review)

N. Malyutin, T.T. Trinh
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Abstract

The review discusses 3D designs of coupled strip lines and their application in microwave devices. It is noted that 3D designs of coupled strip lines have advantages over other strip structures due to the possibility of forming a strong electromagnetic coupling between the strips. This result is achieved by simple technological methods, such as installing a vertical substrate with soldering (or welding) of conductors oriented horizontally and vertically on the substrates, respectively. The article briefly covers the history of development and provides a classification of these structures. The advantages and disadvantages of devices built based on such structures are analyzed. Methods for analyzing them and improving their characteristics are considered. It is emphasized that three-dimensional designs of coupled strip lines represent a promising direction in the development of microwave technologies and can be widely used in various devices.
耦合带状线的三维结构及其在微波设备中的应用(综述)
这篇综述讨论了耦合带状线的三维设计及其在微波设备中的应用。与其他带状结构相比,耦合带状线的三维设计具有优势,因为带状线之间可以形成强大的电磁耦合。这一结果可通过简单的技术方法实现,例如安装垂直基板,在基板上分别焊接(或焊接)水平和垂直方向的导体。文章简要介绍了这些结构的发展历史,并对其进行了分类。文章分析了基于此类结构制造的设备的优缺点。还考虑了分析这些结构和改进其特性的方法。文章强调,耦合带状线的三维设计是微波技术发展的一个前景广阔的方向,可广泛应用于各种设备中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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