High-temperature dielectric with excellent capacitive performance enabled by rationally designed traps in blends

Zhonghua Zhao, Shuo Zhang, Mingru Li, Yang Feng, Liuqing Yang, Shengtao Li
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Abstract

Polymer dielectrics with excellent capacitive performance are urgently needed in advanced electrical and electronic systems. However, due to the dramatic increase in the conduction loss, the energy density and efficiency of polymers degrade severely at elevated temperatures, limiting their application in harsh environments up to 150 °C. Herein, an all-organic polyurea (PU)/polyetherimide (PEI) blend film is designed to prepare high-temperature polymer dielectric. It is found that carrier traps can be introduced by blending, and the hydrogen bond between PU and PEI increases the trap depth, leading to suppressed leakage current and enhanced breakdown strength, thus improving the energy storage performance. PU/30%PEI exhibits a high discharged energy density of ∼3.74 J/cm3 with an efficiency higher than 90% at 150 °C, which is 78% and 70% higher than pristine PU and PEI, respectively. This work provides a facile strategy to improve the energy storage performance of polymer dielectrics by introducing deep traps through blending.
通过在混合物中合理设计阱,实现具有优异电容性能的高温电介质
先进的电气和电子系统迫切需要具有优异电容性能的聚合物电介质。然而,由于传导损耗急剧增加,聚合物的能量密度和效率在高温下严重下降,限制了它们在高达 150 °C 的恶劣环境中的应用。本文设计了一种全有机聚脲(PU)/聚醚酰亚胺(PEI)共混膜来制备高温聚合物电介质。研究发现,通过共混可以引入载流子陷阱,聚氨酯和聚醚酰亚胺之间的氢键增加了陷阱深度,从而抑制了泄漏电流,增强了击穿强度,提高了储能性能。PU/30%PEI 在 150 °C 时的放电能量密度高达 3.74 J/cm3,效率高于 90%,分别比原始 PU 和 PEI 高出 78% 和 70%。这项研究为通过共混引入深阱来提高聚合物电介质的储能性能提供了一种简便的策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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