{"title":"Nonlinear electromechanical topology optimization method for stretchable electronic interconnect structures","authors":"Yunfeng Luo, Shiyuan Qu, Shutian Liu, YongAn Huang","doi":"10.1007/s00366-024-01996-y","DOIUrl":null,"url":null,"abstract":"<p>The conductive interconnect structure that connects the electrical functional devices is an important micro-nano structure in stretchable electronics. Given the reliance of numerous devices on steady electrical currents for operation, stretchable electronics would benefit from interconnects with minimal resistance variation during deformation. This paper proposes a topology optimization method for the design of stretchable interconnect structures with stable resistance under large deformation. In the proposed method, an equal material method considering geometrically nonlinear and electromechanical coupling effects is developed to evaluate the resistance of a deformed structure. Besides, a new connectivity control method is proposed to ensure the connectivity between the inlet and outlet by making full use of the electrical problem itself. To achieve the design goal of connected interconnect structures with negligible resistance fluctuation during stretching, a topology optimization formulation is established, and the corresponding sensitivity is also analytically derived. Several numerical examples show that the proposed method is capable of computationally and intelligently generating stretchable structures with extremely small variations in resistance during stretching.</p>","PeriodicalId":11696,"journal":{"name":"Engineering with Computers","volume":"105 1","pages":""},"PeriodicalIF":8.7000,"publicationDate":"2024-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Engineering with Computers","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s00366-024-01996-y","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"Mathematics","Score":null,"Total":0}
引用次数: 0
Abstract
The conductive interconnect structure that connects the electrical functional devices is an important micro-nano structure in stretchable electronics. Given the reliance of numerous devices on steady electrical currents for operation, stretchable electronics would benefit from interconnects with minimal resistance variation during deformation. This paper proposes a topology optimization method for the design of stretchable interconnect structures with stable resistance under large deformation. In the proposed method, an equal material method considering geometrically nonlinear and electromechanical coupling effects is developed to evaluate the resistance of a deformed structure. Besides, a new connectivity control method is proposed to ensure the connectivity between the inlet and outlet by making full use of the electrical problem itself. To achieve the design goal of connected interconnect structures with negligible resistance fluctuation during stretching, a topology optimization formulation is established, and the corresponding sensitivity is also analytically derived. Several numerical examples show that the proposed method is capable of computationally and intelligently generating stretchable structures with extremely small variations in resistance during stretching.
期刊介绍:
Engineering with Computers is an international journal dedicated to simulation-based engineering. It features original papers and comprehensive reviews on technologies supporting simulation-based engineering, along with demonstrations of operational simulation-based engineering systems. The journal covers various technical areas such as adaptive simulation techniques, engineering databases, CAD geometry integration, mesh generation, parallel simulation methods, simulation frameworks, user interface technologies, and visualization techniques. It also encompasses a wide range of application areas where engineering technologies are applied, spanning from automotive industry applications to medical device design.