The Effect of Temperature on the Current-Carrying Tribological Behaviour of C/Cu Contact Pairs in High Humidity Environments

IF 2.9 3区 工程技术 Q2 ENGINEERING, CHEMICAL
De-Hui Ji, Li Xiao, Qiang Hu, Siyang Chen, Qiuping Li, Mingxue Shen
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Abstract

The environmental temperature alters the frictional behaviour by changing the state of the current-carrying contact interface, which makes the electrical contact invalid. In this work, the effects of three different temperatures (− 20, 0, 20 °C) on the current-carrying tribological behaviour of C–Cu tribo-pairs in high humidity environment (85%) were discussed. The evolution laws of friction coefficient, wear volume, contact surface properties, and contact resistance of tribo-pairs were studied, and the current-carrying wear mechanism of C–Cu at low temperature was analyzed in depth. The variation of friction coefficient with temperature shows a similar rule before and after current-carrying, that is, regardless of the current, the friction coefficient increases as temperature falls. However, the average friction coefficient at each temperature is lower than that without current. Although it will hasten the material surface's oxidation, a drop in temperature will effectively lessen the transfer behaviour of copper to carbon surface and reduce the wear volume of carbon materials. The amount of copper transferred increases as current rises. Compared with current, the change of temperature has a greater impact on the damage of tribo-pairs. At room temperature, the contact resistance under high current is greater than that of low current. However, the rule is just the opposite under low temperature (0 and − 20 °C). In addition, at 0 °C, although the contact resistance of low current (5 A) decreases significantly in the early stage of friction, its average resistance and fluctuation amplitude are the largest. As the temperature decreases, the current-carrying wear mechanism of C–Cu contact pairs gradually changes from adhesive wear to fatigue wear.

Abstract Image

温度对高湿度环境中铜/铜接触对载流摩擦学行为的影响
环境温度通过改变载流接触界面的状态来改变摩擦行为,从而使电接触失效。在这项工作中,讨论了三种不同温度(- 20、0、20 °C)对高湿度环境(85%)下 C-Cu 三元对载流摩擦学行为的影响。研究了摩擦系数、磨损量、接触表面性质和三元对接触电阻的演变规律,并深入分析了低温下 C-Cu 的载流磨损机理。摩擦系数随温度的变化在载流前后呈现出相似的规律,即无论电流大小,摩擦系数都随着温度的降低而增大。但是,每个温度下的平均摩擦系数都低于无电流时的摩擦系数。虽然会加速材料表面的氧化,但温度的降低会有效减少铜向碳表面的转移行为,减少碳材料的磨损量。铜的转移量随着电流的升高而增加。与电流相比,温度变化对三元对损坏的影响更大。在室温下,大电流下的接触电阻大于小电流下的接触电阻。但在低温条件下(0 和 -20 °C),情况正好相反。此外,在 0 °C 时,虽然小电流(5 A)的接触电阻在摩擦初期会显著下降,但其平均电阻和波动幅度最大。随着温度的降低,C-Cu 接触对的载流磨损机制逐渐从粘着磨损转变为疲劳磨损。
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来源期刊
Tribology Letters
Tribology Letters 工程技术-工程:化工
CiteScore
5.30
自引率
9.40%
发文量
116
审稿时长
2.5 months
期刊介绍: Tribology Letters is devoted to the development of the science of tribology and its applications, particularly focusing on publishing high-quality papers at the forefront of tribological science and that address the fundamentals of friction, lubrication, wear, or adhesion. The journal facilitates communication and exchange of seminal ideas among thousands of practitioners who are engaged worldwide in the pursuit of tribology-based science and technology.
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