Mechanical behavior of SiC reinforced ZA63 Mg matrix composites: Experiments and 3D finite element modelling

IF 15.8 1区 材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING
Chong Wang , Zelong Du , Enyu Guo , Shuying Bai , Zongning Chen , Huijun Kang , Guohao Du , Yanling Xue , Tongmin Wang
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Abstract

In this work, the microstructure evolution and mechanical behavior of extruded SiC/ZA63 Mg matrix composites are investigated via combined experimental study and three-dimensional finite element modelling (3D FEM) based on the actual 3D microstructure achieved by synchrotron tomography. The results show that the average grain size of composite increases from 0.57 µm of 8 µm-SiC/ZA63 to 8.73 µm of 50 µm-SiC/ZA63. The type of texture transforms from the typical fiber texture in 8 µm-SiC/ZA63 to intense basal texture in 50 µm-SiC/ZA63 composite and the intensity of texture increases sharply with increase of SiC particle size. The dynamic recrystallization (DRX) mechanism is also changed with increasing SiC particle size. Experimental and simulation results verify that the strength and elongation both decrease with increase of SiC particle size. The 8 µm-SiC/ZA63 composite possesses the optimal mechanical property with yield strength (YS) of 383 MPa, ultimate tensile strength (UTS) of 424 MPa and elongation of 6.3%. The outstanding mechanical property is attributed to the ultrafine grain size, high-density precipitates and dislocation, good loading transfer effect and the interface bonding between SiC and matrix, as well as the weakened basal texture. The simulation results reveal that the micro-cracks tend to initiate at the interface between SiC and matrix, and then propagate along the interface between particle and Mg matrix or at the high strain and stress regions, and further connect with other micro-cracks. The main fracture mechanism in 8 µm-SiC/ZA63 composite is ductile damage of matrix and interfacial debonding. With the increase of particle size, interface strength and particle strength decrease, and interface debonding and particle rupture become the main fracture mechanism in the 30 µm- and 50 µm-SiC/ZA63 composites.
碳化硅增强ZA63镁基复合材料的力学行为:实验和 3D 有限元建模
在同步加速器断层扫描三维显微组织的基础上,采用实验研究和三维有限元模拟相结合的方法,研究了挤压SiC/ZA63 Mg基复合材料的微观组织演变和力学行为。结果表明:复合材料的平均晶粒尺寸由8µm- sic /ZA63的0.57µm增加到50µm- sic /ZA63的8.73µm;织构类型由8µm-SiC/ZA63中典型的纤维织构转变为50µm-SiC/ZA63复合材料中强烈的基底织构,织构强度随着SiC粒度的增大而急剧增大。动态再结晶(DRX)机制也随着SiC粒径的增大而改变。实验和模拟结果表明,随着SiC颗粒尺寸的增大,强度和伸长率均降低。8µm-SiC/ZA63复合材料的屈服强度(YS)为383 MPa,极限抗拉强度(UTS)为424 MPa,延伸率为6.3%,力学性能最佳。优异的力学性能是由于SiC的晶粒尺寸超细、析出相和位错高密度、良好的加载传递效果和SiC与基体之间的界面结合以及基体织构的减弱。模拟结果表明,微裂纹首先在SiC与基体界面处萌生,然后沿颗粒与Mg基体界面或高应变、高应力区域扩展,并与其他微裂纹连接。8 μ m sic /ZA63复合材料的主要断裂机制是基体的韧性损伤和界面的脱粘。随着颗粒尺寸的增大,界面强度和颗粒强度降低,界面脱粘和颗粒断裂成为30µm-和50µm- sic /ZA63复合材料的主要断裂机制。
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来源期刊
Journal of Magnesium and Alloys
Journal of Magnesium and Alloys Engineering-Mechanics of Materials
CiteScore
20.20
自引率
14.80%
发文量
52
审稿时长
59 days
期刊介绍: The Journal of Magnesium and Alloys serves as a global platform for both theoretical and experimental studies in magnesium science and engineering. It welcomes submissions investigating various scientific and engineering factors impacting the metallurgy, processing, microstructure, properties, and applications of magnesium and alloys. The journal covers all aspects of magnesium and alloy research, including raw materials, alloy casting, extrusion and deformation, corrosion and surface treatment, joining and machining, simulation and modeling, microstructure evolution and mechanical properties, new alloy development, magnesium-based composites, bio-materials and energy materials, applications, and recycling.
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