Development of hBN / natural fibers reinforced polymer composites using Grey Relation Grade Analysis for thermal and electrical applications

IF 4.3 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

ACS Applied Electronic Materials Pub Date : 2024-04-15 DOI:10.1088/2631-6331/ad3edd

R. Kirubakaran, Dinesh Ramesh Salunke, Shenbaga Velu Pitchumani, V. Gopalan, Aravindh Sampath

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引用次数: 0

Abstract

The objective of this work is to enhance the thermal conductivity and electrical properties of polymer hybrid composites through a systematic novel Grey Relation Grade Analysis (GRGA) optimization approach. This involves reinforcing the hybrid composites with hexagonal Boron Nitride (hBN) and various kinds of natural fibers or fillers. The development of a unique technology to produce multiphase composites using 2% of natural fibers or fillers such as coir fiber (CF), rice husk filler (RF), wood filler (WF), banana fiber (BF) and sugarcane fiber (SF) along with hBN (1, 3, 5 wt.%) particulates as reinforcements in epoxy matrix. The Taguchi L15 matrix array is utilized to fabricate interlaced composite samples via hand layup molding. Ultrasonic waves are used to ensure the uniform distribution of hBN filler into the matrix. Analysis of variance (ANOVA) and GRGA reveal the significant results. It shows that the multiphase hybrid composites exhibit good thermal conductivity when higher content of hBN (5 wt.%) particulate for all the micro particulate polymer (MPP) composites. Multi-response optimization shows that the micro banana fiber (2 wt.%) interlaces with hBN (5 wt.%) composite exhibits the higher thermal conductivity and electrical resistance compared to all other natural fiber interlaced composites. The aforementioned MPP composite has thermal conductivity of 1.03 W/m.K and electrical resistance of 279.88 Giga Ohms. Besides, the wood filler interlaced hBN (5 wt.%) composite shows the minimum dielectric constant compared to all other natural fiber composites. This desirable result is caused by the proper dispersion of hBN with the matrix which encourages interlocking with the fiber and the matrix. Maximum electrical resistance is observed for composite containing 5 wt.% of h-BN and 2 wt.% of BF. The developed MPP composite could be used in heat shields, electrical insulation components, and interior automotive components like dashboards, luggage compartments and interior walls.

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利用灰色关系等级分析法开发用于热学和电气应用的氢化硼/天然纤维增强聚合物复合材料

这项工作的目的是通过系统化的新型灰色关联等级分析（GRGA）优化方法，提高聚合物混合复合材料的导热性和电气性能。这涉及用六方氮化硼（hBN）和各种天然纤维或填料增强混合复合材料。开发了一种独特的技术，使用 2% 的天然纤维或填料，如椰壳纤维 (CF)、稻壳填料 (RF)、木材填料 (WF)、香蕉纤维 (BF) 和甘蔗纤维 (SF)，以及 hBN（1、3、5 wt.%）微粒作为环氧基体中的增强材料，来生产多相复合材料。利用 Taguchi L15 矩阵阵列通过手糊成型制造交错复合材料样品。使用超声波确保 hBN 填料均匀分布到基体中。方差分析 (ANOVA) 和 GRGA 显示了显著的结果。结果表明，在所有微颗粒聚合物 (MPP) 复合材料中，当 hBN 颗粒含量较高时（5 wt.%），多相杂化复合材料表现出良好的导热性。多响应优化结果表明，与所有其他天然纤维交错复合材料相比，微香蕉纤维（2 wt.%）与 hBN（5 wt.%）交错复合材料具有更高的热导率和电阻率。上述 MPP 复合材料的导热系数为 1.03 W/m.K，电阻为 279.88 千兆欧姆。此外，与所有其他天然纤维复合材料相比，木质填料交错 hBN（5 wt.%）复合材料的介电常数最小。造成这一理想结果的原因是 hBN 与基体的适当分散促进了纤维与基体之间的互锁。含有 5 wt.% 的 h-BN 和 2 wt.% 的 BF 的复合材料的电阻最大。所开发的 MPP 复合材料可用于隔热板、电气绝缘部件以及汽车内饰部件（如仪表板、行李箱和内壁）。

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico