Advances in electroactive bioscaffolds for repairing spinal cord injury.

IF 4.3 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

ACS Applied Electronic Materials Pub Date : 2024-04-18 DOI:10.1088/1748-605X/ad4079

Zeqi Liu, Jiahui Lai, Dexin Kong, Yannan Zhao, Jiakang Zhao, Jianwu Dai, Mingming Zhang

{"title":"Advances in electroactive bioscaffolds for repairing spinal cord injury.","authors":"Zeqi Liu, Jiahui Lai, Dexin Kong, Yannan Zhao, Jiakang Zhao, Jianwu Dai, Mingming Zhang","doi":"10.1088/1748-605X/ad4079","DOIUrl":null,"url":null,"abstract":"Spinal cord injury (SCI) is a devastating neurological disorder, leading to loss of motor or somatosensory function, which is the most challenging worldwide medical problem. Re-establishment of intact neural circuits is the basis of spinal cord regeneration. Considering the crucial role of electrical signals in the nervous system, electroactive bioscaffolds have been widely developed for SCI repair. They can produce conductive pathways and a pro-regenerative microenvironment at the lesion site similar to that of the natural spinal cord, leading to neuronal regeneration and axonal growth, and functionally reactivating the damaged neural circuits. In this review, we first demonstrate the pathophysiological characteristics induced by SCI. Then, the crucial role of electrical signals in SCI repair is introduced. Based on a comprehensive analysis of these characteristics, recent advances in the electroactive bioscaffolds for SCI repair are summarized, focusing on both the conductive bioscaffolds and piezoelectric bioscaffolds, used independently or in combination with external electronic stimulation. Finally, thoughts on challenges and opportunities that may shape the future of bioscaffolds in SCI repair are concluded.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":" 1","pages":""},"PeriodicalIF":4.3000,"publicationDate":"2024-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1748-605X/ad4079","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Spinal cord injury (SCI) is a devastating neurological disorder, leading to loss of motor or somatosensory function, which is the most challenging worldwide medical problem. Re-establishment of intact neural circuits is the basis of spinal cord regeneration. Considering the crucial role of electrical signals in the nervous system, electroactive bioscaffolds have been widely developed for SCI repair. They can produce conductive pathways and a pro-regenerative microenvironment at the lesion site similar to that of the natural spinal cord, leading to neuronal regeneration and axonal growth, and functionally reactivating the damaged neural circuits. In this review, we first demonstrate the pathophysiological characteristics induced by SCI. Then, the crucial role of electrical signals in SCI repair is introduced. Based on a comprehensive analysis of these characteristics, recent advances in the electroactive bioscaffolds for SCI repair are summarized, focusing on both the conductive bioscaffolds and piezoelectric bioscaffolds, used independently or in combination with external electronic stimulation. Finally, thoughts on challenges and opportunities that may shape the future of bioscaffolds in SCI repair are concluded.

查看原文本刊更多论文

用于修复脊髓损伤的电活性生物支架的进展。

脊髓损伤（SCI）是一种破坏性神经系统疾病，会导致运动或躯体感觉功能丧失，是最具挑战性的世界性医学难题。重建完整的神经回路是脊髓再生的基础。考虑到电信号在神经系统中的关键作用，人们广泛开发了用于脊髓损伤修复的电活性生物支架。它们可以在病变部位产生类似于自然脊髓的导电通路和有利于再生的微环境，从而促进神经元再生和轴突生长，并在功能上重新激活受损的神经回路。在这篇综述中，我们首先展示了损伤性脊髓炎诱发的病理生理特征。然后，介绍电信号在 SCI 修复中的关键作用。在对这些特征进行全面分析的基础上，总结了用于 SCI 修复的电活性生物支架的最新进展，重点介绍了独立使用或与外部电子刺激结合使用的导电生物支架和压电生物支架。最后，总结了生物支架在 SCI 修复中的未来可能面临的挑战和机遇。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico