Bingkun Wang, Jun Jiang, Kevin Baldwin, Huijuan Wu, Li Zheng, Mingming Gong, Xuehai Ju, Gang Wang, Caichao Ye, Yongqiang Wang
{"title":"Direct Synthesis of Layer-Tunable and Transfer-Free Graphene on Device-Compatible Substrates Using Ion Implantation Toward Versatile Applications","authors":"Bingkun Wang, Jun Jiang, Kevin Baldwin, Huijuan Wu, Li Zheng, Mingming Gong, Xuehai Ju, Gang Wang, Caichao Ye, Yongqiang Wang","doi":"10.1002/eem2.12730","DOIUrl":null,"url":null,"abstract":"<p>Direct synthesis of layer-tunable and transfer-free graphene on technologically important substrates is highly valued for various electronics and device applications. State of the art in the field is currently a two-step process: a high-quality graphene layer synthesis on metal substrate through chemical vapor deposition (CVD) followed by delicate layer transfer onto device-relevant substrates. Here, we report a novel synthesis approach combining ion implantation for a precise graphene layer control and dual-metal smart Janus substrate for a diffusion-limiting graphene formation to directly synthesize large area, high quality, and layer-tunable graphene films on arbitrary substrates without the post-synthesis layer transfer process. Carbon (C) ion implantation was performed on Cu–Ni film deposited on a variety of device-relevant substrates. A well-controlled number of layers of graphene, primarily monolayer and bilayer, is precisely controlled by the equivalent fluence of the implanted C-atoms (1 monolayer ~4 × 10<sup>15</sup> C-atoms/cm<sup>2</sup>). Upon thermal annealing to promote Cu-Ni alloying, the pre-implanted C-atoms in the Ni layer are pushed toward the Ni/substrate interface by the top Cu layer due to the poor C-solubility in Cu. As a result, the expelled C-atoms precipitate into a graphene structure at the interface facilitated by the Cu-like alloy catalysis. After removing the alloyed Cu-like surface layer, the layer-tunable graphene on the desired substrate is directly realized. The layer-selectivity, high quality, and uniformity of the graphene films are not only confirmed with detailed characterizations using a suite of surface analysis techniques but more importantly are successfully demonstrated by the excellent properties and performance of several devices directly fabricated from these graphene films. Molecular dynamics (MD) simulations using the reactive force field (ReaxFF) were performed to elucidate the graphene formation mechanisms in this novel synthesis approach. With the wide use of ion implantation technology in the microelectronics industry, this novel graphene synthesis approach with precise layer-tunability and transfer-free processing has the promise to advance efficient graphene-device manufacturing and expedite their versatile applications in many fields.</p>","PeriodicalId":11554,"journal":{"name":"Energy & Environmental Materials","volume":"7 5","pages":""},"PeriodicalIF":13.0000,"publicationDate":"2024-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/eem2.12730","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Energy & Environmental Materials","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/eem2.12730","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Direct synthesis of layer-tunable and transfer-free graphene on technologically important substrates is highly valued for various electronics and device applications. State of the art in the field is currently a two-step process: a high-quality graphene layer synthesis on metal substrate through chemical vapor deposition (CVD) followed by delicate layer transfer onto device-relevant substrates. Here, we report a novel synthesis approach combining ion implantation for a precise graphene layer control and dual-metal smart Janus substrate for a diffusion-limiting graphene formation to directly synthesize large area, high quality, and layer-tunable graphene films on arbitrary substrates without the post-synthesis layer transfer process. Carbon (C) ion implantation was performed on Cu–Ni film deposited on a variety of device-relevant substrates. A well-controlled number of layers of graphene, primarily monolayer and bilayer, is precisely controlled by the equivalent fluence of the implanted C-atoms (1 monolayer ~4 × 1015 C-atoms/cm2). Upon thermal annealing to promote Cu-Ni alloying, the pre-implanted C-atoms in the Ni layer are pushed toward the Ni/substrate interface by the top Cu layer due to the poor C-solubility in Cu. As a result, the expelled C-atoms precipitate into a graphene structure at the interface facilitated by the Cu-like alloy catalysis. After removing the alloyed Cu-like surface layer, the layer-tunable graphene on the desired substrate is directly realized. The layer-selectivity, high quality, and uniformity of the graphene films are not only confirmed with detailed characterizations using a suite of surface analysis techniques but more importantly are successfully demonstrated by the excellent properties and performance of several devices directly fabricated from these graphene films. Molecular dynamics (MD) simulations using the reactive force field (ReaxFF) were performed to elucidate the graphene formation mechanisms in this novel synthesis approach. With the wide use of ion implantation technology in the microelectronics industry, this novel graphene synthesis approach with precise layer-tunability and transfer-free processing has the promise to advance efficient graphene-device manufacturing and expedite their versatile applications in many fields.
在具有重要技术意义的基底上直接合成层可调且无转移的石墨烯,在各种电子和设备应用中具有极高的价值。目前,该领域的最新技术分为两步:通过化学气相沉积(CVD)在金属基底上合成高质量的石墨烯层,然后将精细的石墨烯层转移到与设备相关的基底上。在此,我们报告了一种新颖的合成方法,该方法结合了离子注入法(用于精确控制石墨烯层)和双金属智能 Janus 衬底(用于限制扩散的石墨烯形成),可直接在任意衬底上合成大面积、高质量和层可调的石墨烯薄膜,而无需合成后的层转移过程。在沉积在各种设备相关基底上的铜镍薄膜上进行了碳(C)离子注入。植入碳原子的等效通量(1 单层 ~4 × 1015 碳原子/cm2)精确控制了石墨烯的层数,主要是单层和双层石墨烯。在进行热退火以促进铜-镍合金化时,由于 C 在铜中的溶解度较低,镍层中预先植入的 C 原子会被顶部的铜层推向镍/基底界面。结果,在类铜合金的催化作用下,被排出的 C 原子在界面处沉淀成石墨烯结构。在去除合金化的类铜表面层后,就可以直接在所需的基底上实现层可调的石墨烯。石墨烯薄膜的层选择性、高质量和均匀性不仅通过一系列表面分析技术的详细表征得到了证实,更重要的是,由这些石墨烯薄膜直接制成的几种器件的优异性能和表现成功地证明了这一点。使用反应力场(ReaxFF)进行了分子动力学(MD)模拟,以阐明这种新型合成方法中的石墨烯形成机制。随着离子注入技术在微电子行业的广泛应用,这种具有精确层可调性和免转移处理的新型石墨烯合成方法有望推动石墨烯器件的高效制造,并加快其在许多领域的广泛应用。
期刊介绍:
Energy & Environmental Materials (EEM) is an international journal published by Zhengzhou University in collaboration with John Wiley & Sons, Inc. The journal aims to publish high quality research related to materials for energy harvesting, conversion, storage, and transport, as well as for creating a cleaner environment. EEM welcomes research work of significant general interest that has a high impact on society-relevant technological advances. The scope of the journal is intentionally broad, recognizing the complexity of issues and challenges related to energy and environmental materials. Therefore, interdisciplinary work across basic science and engineering disciplines is particularly encouraged. The areas covered by the journal include, but are not limited to, materials and composites for photovoltaics and photoelectrochemistry, bioprocessing, batteries, fuel cells, supercapacitors, clean air, and devices with multifunctionality. The readership of the journal includes chemical, physical, biological, materials, and environmental scientists and engineers from academia, industry, and policy-making.