Beyond Wires: The Future of Interconnects

IF 2.8 3区计算机科学 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Micro Pub Date : 2024-04-05 DOI:10.1109/mm.2024.3373336

Hsien-Hsin S. Lee

引用次数: 0

Abstract

This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.

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超越电线：互联的未来

本期介绍了最初在 2023 年 Hot Interconnects（HotI-30）上发表的部分优秀论文，并刊登了一篇来自 Meta Reality Labs 的文章，探讨如何将内存计算用于 AR/VR 应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Micro 工程技术-计算机：软件工程

CiteScore

7.50

自引率

0.00%

发文量

164

审稿时长

>12 weeks

期刊介绍： IEEE Micro addresses users and designers of microprocessors and microprocessor systems, including managers, engineers, consultants, educators, and students involved with computers and peripherals, components and subassemblies, communications, instrumentation and control equipment, and guidance systems. Contributions should relate to the design, performance, or application of microprocessors and microcomputers. Tutorials, review papers, and discussions are also welcome. Sample topic areas include architecture, communications, data acquisition, control, hardware and software design/implementation, algorithms (including program listings), digital signal processing, microprocessor support hardware, operating systems, computer aided design, languages, application software, and development systems.