Efficient Thermal Management Strategies for 3D-SiP Architectures

Abstract

The thermal management of three-dimensional System-in-Package (3D-SiP) has garnered significant attention from researchers. Through Silicon Vias (TSVs) have been extensively studied for their role in improving heat dissipation and addressing hot spot issues. Additionally, other techniques like Micro-Channels Heat Sinks (MCHS) and Micro Pin-Fin Heat Sinks (MPFHS) have been explored to enhance 3D-SiP performance. Many thermal management issues stem from uneven temperature distribution on chip surfaces, leading to temperature gradients along the flow path. In a novel approach, this study combines the assessment of both techniques in a single investigation, presenting a distinctive contribution to enhancing thermal management efficiency. Utilizing the Finite Element Method (FEM) with ANSYS software, the study will conduct modeling and simulation to validate heat dissipation pathways, aiming to optimize the thermal performance of 3D-SiP assemblies. The focus will primarily be on how various geometric and thermophysical characteristics affect the heat dissipation capabilities of SiPs. The study's results, which led to an 84% reduction in maximum temperature inside the SiP, could serve as a crucial foundation for developing tailored thermal design guidelines for 3D-SiPs. This would significantly contribute to the ingenious optimization of thermal management strategies.