Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part III

Abstract

This article is the third in a multi-part series describing techniques for thinning and polishing a highly warped die. Tighter thickness tolerance and thinner samples are always desired. The first article addressed global thinning of a sample. The second focused on the process and problems of thinning only the area of interest. This installment covers processes and considerations for both global and area of interest treatment and provides reference process recipes.