Direct slicing of microcellular structures for digital light processing (DLP) additive manufacturing

Seoyeah Oh, Keun Park
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Abstract

Purpose Additive Manufacturing (AM) conventionally necessitates an intermediary slicing procedure using the standard tessellation language (STL) data, which can be computationally burdensome, especially for intricate microcellular architectures. This study aims to propose a direct slicing method tailored for digital light processing-type AM processes for the efficient generation of slicing data for microcellular structures. Design/methodology/approach The authors proposed a direct slicing method designed for microcellular structures, encompassing micro-lattice and triply periodic minimal surface (TPMS) structures. The sliced data of these structures were represented mathematically and then convert into 2D monochromatic images, bypassing the time-consuming slicing procedures required by 3D STL data. The efficiency of the proposed method was validated through data preparations for lattice-based nasopharyngeal swabs and TPMS-based ellipsoid components. Furthermore, its adaptability was highlighted by incorporating 2D images of additional features, eliminating the requirement for complex 3D Boolean operations. Findings The direct slicing method offered significant benefits upon implementation for microcellular structures. For lattice-based nasopharyngeal swabs, it reduced data size by a factor of 1/300 and data preparation time by a factor of 1/8. Similarly, for TPMS-based ellipsoid components, it reduced data size by a factor of 1/60 and preparation time by a factor of 1/16. Originality/value The direct slicing method allows for bypasses the computational burdens associated with traditional indirect slicing from 3D STL data, by directly translating complex cellular structures into 2D sliced images. This method not only reduces data volume and processing time significantly but also demonstrates the versatility of sliced data preparation by integrating supplementary features using 2D operations.
为数字光处理(DLP)快速成型制造直接切割微孔结构
目的快速成型制造(AM)传统上需要使用标准网格语言(STL)数据进行中间切片程序,这可能会造成计算负担,尤其是对于复杂的微孔结构而言。本研究旨在提出一种为数字光处理型 AM 工艺量身定制的直接切片方法,以高效生成微蜂窝结构的切片数据。作者提出了一种专为微蜂窝结构设计的直接切片方法,包括微晶格和三周期最小表面(TPMS)结构。这些结构的切片数据用数学方法表示,然后转换成二维单色图像,绕过了三维 STL 数据所需的耗时切片程序。通过对基于网格的鼻咽拭子和基于 TPMS 的椭圆组件进行数据准备,验证了所建议方法的效率。此外,该方法的适应性还体现在加入了额外特征的二维图像,从而省去了复杂的三维布尔运算。对于基于网格的鼻咽拭子,它将数据大小减少了 1/300 倍,将数据准备时间减少了 1/8 倍。同样,对于基于 TPMS 的椭圆形组件,它将数据量减少了 1/60,将准备时间减少了 1/16。 原创性/价值 这种直接切片方法通过将复杂的细胞结构直接转化为二维切片图像,从而绕过了传统的从三维 STL 数据间接切片所带来的计算负担。这种方法不仅大大减少了数据量和处理时间,而且通过使用二维操作整合补充特征,展示了切片数据制备的多功能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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