Review on thermal management technologies for electronics in spacecraft environment

Yi-Gao Lv , Yao-Ting Wang , Tong Meng , Qiu-Wang Wang , Wen-Xiao Chu
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Abstract

Due to the rapid development of the space industry, ever higher demands are being made for the optimization and improvement of spacecraft thermal management systems. Thermal control technology has become one of the key bottlenecks that restrict the level of spacecraft design. In this paper, the thermal management technologies (TMTs) for spacecraft electronics are reviewed according to the different heat transfer processes, including heat acquisition, heat transport, and heat rejection. The researches on efficient heat acquisition include the utilization of high thermal conductance materials, the development of novel package structure based on micro-/nano-electromechanical system (MEMS/NEMS) technologies, and advanced near-junction microfluidic cooling techniques. For the heat transport process, various heat pipes and mechanical pumped fluid loops (MPFLs) are widely implemented to transport heat from heat generation components to the ultimate heat sinks. The heat pipes are divided into two categories based on their structure layout, i.e., separated heat pipes and unseparated heat pipes. The merits and demerits of these heat pipes and MPFLs (including the single-phase MPFL and the two-phase MPFL) are discussed and summarized respectively. In terms of the heat rejection for spacecraft, thermal radiators are normally the sole option due to the unique space environment. To meet the requirements of large heat dissipation power and fluctuated thermal environment, research efforts on the radiators mainly focus on the development of deployable radiators, variable emissivity radiators, and the combination with other techniques. Due to the fluctuated characteristics of the heat power of internal electronics and the outer thermal environment, the phase change materials (PCMs) exhibit great advantages in this scenario and have attracted a lot of research attention. This review aims to serve as a reference guide for the development of thermal management system in the future spacecraft.

航天器环境中电子设备热管理技术综述
随着航天工业的飞速发展,对航天器热管理系统的优化和改进提出了越来越高的要求。热控技术已成为制约航天器设计水平的关键瓶颈之一。本文根据不同的传热过程,包括热获取、热传输和热排出,对航天器电子设备的热管理技术(TMT)进行了综述。高效热获取方面的研究包括利用高导热材料、开发基于微/纳米机电系统(MEMS/NEMS)技术的新型封装结构以及先进的近结微流控冷却技术。在热量传输过程中,各种热管和机械泵流体回路(MPFL)被广泛应用于将热量从发热元件传输到最终的散热器。热管根据其结构布局可分为两类,即分离式热管和非分离式热管。本文分别讨论和总结了这些热管和 MPFL(包括单相 MPFL 和双相 MPFL)的优缺点。在航天器的散热方面,由于太空环境的特殊性,散热器通常是唯一的选择。为了满足大散热功率和波动热环境的要求,散热器的研究工作主要集中在开发可部署散热器、可变发射率散热器以及与其他技术的结合上。由于内部电子设备的热功率和外部热环境的波动特性,相变材料(PCM)在这种情况下表现出极大的优势,吸引了大量研究人员的关注。本综述旨在为未来航天器热管理系统的开发提供参考指南。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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