Low Loss and Low EMI Noise Trench IGBT with Shallow Emitter Trench Controlled p-Type Dummy Region

IF 1.6 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jinping Zhang;Xiaofeng Li;Rongrong Zhu;Kang Wang;Bo Zhang;Chunfu Zhang
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引用次数: 0

Abstract

A novel trench insulated gate bipolar transistor (TIGBT) with a shallow emitter trench controlled P-type dummy region (STCP-TIGBT) is proposed. Compared with the conventional TIGBT with floating P-type dummy region (CFP-TIGBT) and TIGBT with floating P-type dummy region and normally on hole path (HFP-TIGBT), the proposed STCP structure not only speeds up the extraction of excessive holes in the turn-off process but also reduces the Miller plateau charge $(Q_{\text{gc}})$ . Therefore, both the power loss and electromagnetic interference (EMI) noise are significantly reduced. Simulation results show that the $Q_{\text{gc}}$ of the proposed device is only 501 $\text{nC}/\text{cm}^{2}$ , which is reduced by 58.5% and 26.4% when compared to the CFP-TIGBT and HFP-TIGBT, respectively. At same on-state voltage drop $(V_{\text{ceon}})$ of 1.02 V, the turn-off loss $(E_{\text{off})})$ of the proposed device is 13.49 $\text{mJ}/\text{cm}^{2}$ , which is 64.6% and 67.6% less than those of the CFP-TIGBT and HFP-TIGBT, respectively. Moreover, the reverse recovery $\mathrm{d}V_{\text{ak}}/\text{dt}$ of the freewheeling diode at same turn-on loss $(E_{\text{on}})$ of 31.8 $\text{mJ}/\text{cm}^{2}$ for the proposed STCP-TIGBT is only 2.15 $\text{kV}/\mu \mathrm{s}$ , which is reduced by 91.3% and 57.2% when compared to 24.69 $\mathrm{kV}/\mu \mathrm{s}$ and 5.02 $\mathrm{kV}/\mu \mathrm{s}$ for the CFP-TIGBT and HFP-TIGBT, respectively. The reduced $\mathrm{d}V/\mathrm{d}t$ significantly suppresses the electromagnetic interference noise generated by the proposed device.
带浅发射极沟槽控制 p 型哑区的低损耗、低 EMI 噪声沟槽式 IGBT
我们提出了一种新型沟道绝缘栅双极晶体管(TIGBT),它具有浅发射极沟道控制 P 型哑区(STP-TIGBT)。与传统的具有浮动 P 型哑区的 TIGBT(CFP-TIGBT)和具有浮动 P 型哑区且通常在孔通路上的 TIGBT(HFP-TIGBT)相比,所提出的 STCP 结构不仅加快了关断过程中过量孔的提取,而且降低了米勒高原电荷 $(Q_{text{gc}})$。因此,功率损耗和电磁干扰(EMI)噪声都显著降低。仿真结果表明,与 CFP-TIGBT 和 HFP-TIGBT 相比,拟议器件的 $Q_{text{gc}}$ 仅为 501 $\text{nC}/\text{cm}^{2}$,分别降低了 58.5% 和 26.4%。在相同的导通压降 $(V_{\text{ceon}})$ 为 1.02 V 时,所提出器件的关断损耗 $(E_{\text{off})})$ 为 13.49 $\text{mJ}/\text{cm}^{2}$,比 CFP-TIGBT 和 HFP-TIGBT 分别降低了 64.6% 和 67.6%。此外,在相同的导通损耗$(E_{\text{on}})$为31.8 $\text{mJ}/\text{cm}^{2}$时,所提出的STCP-TIGBT的续流二极管的反向恢复$\mathrm{d}V_{\text{ak}}/\text{dt}$仅为2.与 CFP-TIGBT 和 HFP-TIGBT 的 24.69 $\mathrm{kV}/\mu \mathrm{s}$ 和 5.02 $\mathrm{kV}/\mu \mathrm{s}$ 相比,分别降低了 91.3% 和 57.2%。降低的 $\mathrm{d}V/\mathrm{d}t$ 显著抑制了拟议器件产生的电磁干扰噪声。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Chinese Journal of Electronics
Chinese Journal of Electronics 工程技术-工程:电子与电气
CiteScore
3.70
自引率
16.70%
发文量
342
审稿时长
12.0 months
期刊介绍: CJE focuses on the emerging fields of electronics, publishing innovative and transformative research papers. Most of the papers published in CJE are from universities and research institutes, presenting their innovative research results. Both theoretical and practical contributions are encouraged, and original research papers reporting novel solutions to the hot topics in electronics are strongly recommended.
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