{"title":"High speed wafer grooving with UV-USP lasers","authors":"Kees Biesheuvel, Patrick Huberts","doi":"10.1002/phvs.202400009","DOIUrl":null,"url":null,"abstract":"<p>This article explores the application of ultraviolet ultrashort-pulse (UV-USP) laser grooving in tandem with other process steps such as plasma dicing as a practical approach to enable advanced microelectronic packaging. The non-contact nature of UV-USP laser grooving, along with its ability to ablate material with minimal lateral thermal damage, results in clean and precise grooving lines.</p>","PeriodicalId":101021,"journal":{"name":"PhotonicsViews","volume":"21 2","pages":"48-51"},"PeriodicalIF":0.0000,"publicationDate":"2024-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/phvs.202400009","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"PhotonicsViews","FirstCategoryId":"1085","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/phvs.202400009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
This article explores the application of ultraviolet ultrashort-pulse (UV-USP) laser grooving in tandem with other process steps such as plasma dicing as a practical approach to enable advanced microelectronic packaging. The non-contact nature of UV-USP laser grooving, along with its ability to ablate material with minimal lateral thermal damage, results in clean and precise grooving lines.
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