Synergistic enhancement of toughness and flame retardation for cyanate ester composites through hyperbranched polyborosiloxane

IF 3.8 4区工程技术 Q2 CHEMISTRY, APPLIED

Journal of Vinyl & Additive Technology Pub Date : 2024-03-29 DOI:10.1002/vnl.22102

Bin Wei, Rui Liu, Guoquan Qi, Guangpeng Feng, Zheng Li, Yifeng Zhang, Hongxia Yan

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引用次数: 0

Abstract

Excellent flame resistance is supposed to be taken into consideration for electronic packaging materials due to the spontaneous combustion of short circuits, except for good mechanical and dielectric properties. Herein, a hyperbranched polyborosiloxane (HPSiB) flame retardant was synthesized via a simple one-pot transesterification as a multifunctional additive for cyanate ester (CE) resin. The HPSiB with many active terminals features good compatibility with the resin matrix, while catalyzing the curing reaction that conducts at a lower temperature. With as little as 2 wt% HPSiB incorporated, the HPSiB/bisphenol A cyanate ester (BADCy) resin achieves a UL-94 V0 rating and 32.4% LOI value, and its peak heat release and total smoke production are simultaneously reduced. Its flexural strength and impact strength were significantly enhanced by 30.0% and 85.4%. Besides, the minimum values of dielectric constant and loss can reach 2.77 and 0.0024 at 10 GHz, which are, respectively, reduced by 7.9% and 88.5%. The integration of unique hyperbranched SiOB backbone of HPSiB with CE crosslinked network was responsible for the enhanced overall performance. This work paves a facile strategy to develop multifunctional flame retardant as a promising candidate for the high-performance electronic packaging materials.

Highlights

A novel hyperbranched polyborosiloxane flame retardant was synthesized.
HPSiB shows good compatibility and catalyzes the curing reaction of CE resin.
HPSiB/CE resin with significantly enhanced flame retardancy was obtained.
Simultaneously high toughness and low dielectric loss were achieved.
Hyperbranched structure containing SiOB chains led to the great enhancement.

Abstract Image

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通过超支化聚硼硅氧烷协同提高氰酸酯复合材料的韧性和阻燃性能

由于短路时会发生自燃，因此除了良好的机械性能和介电性能外，电子封装材料还必须具备出色的阻燃性能。本文通过简单的一锅酯交换反应合成了一种超支化聚硼硅氧烷（HPSiB）阻燃剂，作为氰酸酯（CE）树脂的多功能添加剂。HPSiB 具有多种活性基团，与树脂基体具有良好的相容性，同时还能催化在较低温度下进行的固化反应。只要加入 2 wt% 的 HPSiB，HPSiB/双酚 A 氰酸酯（BADCy）树脂就能达到 UL-94 V0 级和 32.4% 的 LOI 值，同时还能降低峰值放热量和总产烟量。其抗弯强度和冲击强度分别显著提高了 30.0% 和 85.4%。此外，介电常数和损耗的最小值在 10 GHz 时可达到 2.77 和 0.0024，分别降低了 7.9% 和 88.5%。HPSiB 的独特超支化 SiOB 骨架与 CE 交联网络的整合是整体性能得以提高的原因。这项研究为开发多功能阻燃剂铺平了道路，使其成为高性能电子封装材料的理想候选材料。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Vinyl & Additive Technology 工程技术-材料科学：纺织

CiteScore

5.40

自引率

14.80%

发文量

审稿时长

>12 weeks

期刊介绍： Journal of Vinyl and Additive Technology is a peer-reviewed technical publication for new work in the fields of polymer modifiers and additives, vinyl polymers and selected review papers. Over half of all papers in JVAT are based on technology of additives and modifiers for all classes of polymers: thermoset polymers and both condensation and addition thermoplastics. Papers on vinyl technology include PVC additives.