Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

IF 1.8 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY
Jangwon Seo, Sanghuck Jeon, Jongwook Yoon, Joonho An, Yongsoo Choi, Hyunho Seok, Seunghwan Lee, Pengzhan Liu, Wookyung Jeon, Taesung Kim
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引用次数: 0

Abstract

Traditionally, the pad roughness has been maintained by wearing down the polyurethane pad with diamond disk. However, that method generates debris and reduces pad lifetime. This study propose a new approach to pad surface recovery by synthesizing a polyurethane-based raw material that exhibits shape memory behavior and can recover its shape upon heating. The findings suggest that the pad’s surface can be maintained by utilizing its shape memory trait and designing a system to heat the pad. The pad recovery tests were conducted using universal test machine (UTM) samples and found that, in terms of heat recovery, increasing the temperature had a greater effect than increasing the exposure time. CMP test was performed by using three conditioning potions: diamond disk conditioning, heat conditioning, and no conditioning. The results showed that pad asperity was recovered more efficiently with heat conditioning than with no conditioning (demonstrated by a 19% higher removal rate). The experimental results can be expected that combines diamond disk conditioning with heat conditioning could be a superior alternative for pad surface refreshment. Shape memory pads can return to their original form, leading to better chemical mechanical planarization (CMP) performance and an extended pad lifetime.
利用聚氨酯 CMP 衬垫的热形状记忆特性开发新型调节方法
传统上,垫片的粗糙度是通过金刚石盘磨损聚氨酯垫片来保持的。然而,这种方法会产生碎屑,缩短衬垫的使用寿命。本研究提出了一种新的衬垫表面恢复方法,即合成一种聚氨酯基原材料,这种原材料具有形状记忆特性,加热后可恢复形状。研究结果表明,利用聚氨酯的形状记忆特性并设计一套加热系统,可以保持衬垫的表面。使用万能试验机 (UTM) 样品进行了焊盘恢复测试,结果发现,就热恢复而言,提高温度比延长暴露时间更有效果。通过使用三种调节药剂进行了 CMP 测试:金刚石盘调节、热调节和无调节。结果表明,使用热调节比不使用调节能更有效地恢复衬垫表面粗糙度(去除率高出 19%)。实验结果表明,将金刚石盘调理与热调理结合起来,可能是一种更好的垫片表面修复方法。形状记忆焊盘可以恢复到原来的形状,从而提高化学机械平坦化(CMP)性能,延长焊盘的使用寿命。
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来源期刊
ECS Journal of Solid State Science and Technology
ECS Journal of Solid State Science and Technology MATERIALS SCIENCE, MULTIDISCIPLINARY-PHYSICS, APPLIED
CiteScore
4.50
自引率
13.60%
发文量
455
期刊介绍: The ECS Journal of Solid State Science and Technology (JSS) was launched in 2012, and publishes outstanding research covering fundamental and applied areas of solid state science and technology, including experimental and theoretical aspects of the chemistry and physics of materials and devices. JSS has five topical interest areas: carbon nanostructures and devices dielectric science and materials electronic materials and processing electronic and photonic devices and systems luminescence and display materials, devices and processing.
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