Preheated acid associated with silane and electric current in the adhesion of the resin cement to ceramic.

Brazilian dental journal Pub Date : 2024-03-22 eCollection Date: 2024-01-01 DOI:10.1590/0103-6440202405641
Gustavo Belmiro Casaburi, Marcos Henrique Ramos da Silva, Lourenço Correr-Sobrinho, Rafael Leonardo Xediek Consani
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Abstract

This study verified the effect of the combination of preheated hydrofluoric acid/silane/electric current in the adhesion of the resin cement to ceramic. IPS E.max Press ceramic discs embedded in PVC rigid tubes were divided into four groups associating preheated hydrofluoric acid and silane applied with electrical current (n=10): Ha+S (Heated acid + silane); Ha+S+Ec (Heated acid + silane + electrical current); A+S (Acid + silane) and A+S+Ec (Acid + silano + electrical current). Resin cement/ceramic samples were stored in water at 37°C for 24h. After storage, they were submitted to the microshear test, fracture analysis, and contact angle at 24h or after thermocycling (10,000 cycles/5-55ºC). Bond strength data were evaluated by two-way ANOVA. For comparison between evaluation times (24h or thermocycling) was applied unpaired t-test. A significance post-hoc test of p=0.05 was assumed for analyses and graphs (GraphPad Prism 9.0 software). At 24h, the microshear strength showed similar values between Ha+S, Ha+S+Ec, and A+S+Ec groups, while A+S showed the lowest value with a statistical difference. After thermocycling, Ha+S and Ha+S+Ec were similar, as well as A+S and A+S+Ec. There was a significant difference in all groups comparing 24h (highest value) with after thermocycling (lowest value). Adhesive fracture was predominant in all groups and evaluation times. Ha+S and A+S groups showed higher contact angle values compared to the Ha+S+Ec and A+S+Ec with lower values. In conclusion, the association of preheated hydrofluoric acid/silane applied or not with electric current promoted different microshear strength values, fracture types, and contact angles in the resin cement/ceramic bond.

在树脂水泥与陶瓷的粘合过程中,预热的酸与硅烷和电流相关联。
本研究验证了预热氢氟酸/硅烷/电流的组合对树脂粘接剂与陶瓷粘接的影响。将嵌入 PVC 硬管中的 IPS E.max Press 陶瓷盘分为四组,分别使用预热的氢氟酸和硅烷并施加电流(n=10):Ha+S(加热的酸+硅烷);Ha+S+Ec(加热的酸+硅烷+电流);A+S(酸+硅烷)和 A+S+Ec(酸+硅烷+电流)。树脂水泥/陶瓷样品在 37°C 的水中储存 24 小时。储存后,在 24 小时内或热循环(10,000 次/5-55ºC)后进行微剪切测试、断裂分析和接触角测试。粘接强度数据通过双向方差分析进行评估。评估时间(24 小时或热循环)之间的比较采用非配对 t 检验。分析和图表采用 p=0.05 的显著性事后检验(GraphPad Prism 9.0 软件)。24 小时后,Ha+S 组、Ha+S+Ec 组和 A+S+Ec 组的微剪切强度值相似,而 A+S 组的微剪切强度值最低,但有统计学差异。热循环后,Ha+S 组和 Ha+S+Ec 组相似,A+S 组和 A+S+Ec 组也相似。24 小时后(最高值)与热循环后(最低值)相比,所有组别都有明显差异。粘合剂断裂在所有组别和评估时间内都占主导地位。Ha+S 组和 A+S 组的接触角值较高,而 Ha+S+Ec 组和 A+S+Ec 组的接触角值较低。总之,预热的氢氟酸/硅烷是否与电流结合会促进树脂水泥/陶瓷粘合剂产生不同的微剪切强度值、断裂类型和接触角。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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