Molecular Understanding of the Distinction between Adhesive Failure and Cohesive Failure in Adhesive Bonds with Epoxy Resin Adhesives

IF 3.7 2区 化学 Q2 CHEMISTRY, MULTIDISCIPLINARY
Yuta Tsuji*, 
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Abstract

In the development of adhesives, an understanding of the fracture behavior of the bonded joints is inevitable. Two typical failure modes are known: adhesive failure and cohesive failure. However, a molecular understanding of the cohesive failure process is not as advanced as that of the adhesive failure process. In this study, research was developed to establish a molecular understanding of cohesive failure using the example of a system in which epoxy resin is bonded to a hydroxyl-terminated self-assembled monolayer (SAM) surface. Adhesive failure was modeled as a process in which an epoxy molecule is pulled away from the SAM surface. Cohesive failure, on the other hand, was modeled as the process of an epoxy molecule separating from another epoxy molecule on the SAM surface or breaking of a covalent bond within the epoxy resin. The results of the simulations based on the models described above showed that the results of the calculations using the model of cohesive failure based on the breakdown of intermolecular interactions agreed well with the experimental results in the literature. Therefore, it was suggested that the cohesive failure of epoxy resin adhesives is most likely due to the breakdown of intermolecular interactions between adhesive molecules. We further analyzed the interactions at the adhesive failure and cohesive failure interfaces and found that the interactions at the cohesive failure interface are mainly accounted for by dispersion forces, whereas the interactions at the adhesive failure interface involve not only dispersion forces but also various chemical interactions, including hydrogen bonds. The selectivity between adhesive failure and cohesive failure was explained by the fact that varying the functional group density affected the chemical interactions but not the dispersion forces.

Abstract Image

Abstract Image

从分子角度理解环氧树脂粘合剂粘合失效与内聚失效的区别
在开发粘合剂的过程中,了解粘合接头的断裂行为是不可避免的。目前已知两种典型的破坏模式:粘合破坏和内聚破坏。然而,对内聚破坏过程的分子认识还不如对粘合破坏过程的认识先进。本研究以环氧树脂与羟基封端自组装单层(SAM)表面粘合的系统为例,建立了对内聚失效的分子认识。粘合失效被模拟为环氧树脂分子被拉离 SAM 表面的过程。另一方面,内聚失效被模拟为环氧分子与 SAM 表面上的另一个环氧分子分离或环氧树脂内部共价键断裂的过程。根据上述模型模拟的结果表明,基于分子间相互作用破坏的内聚破坏模型的计算结果与文献中的实验结果非常吻合。因此,我们认为环氧树脂粘合剂的内聚失效很可能是由于粘合剂分子之间的分子间相互作用破坏造成的。我们进一步分析了粘合失效界面和内聚失效界面上的相互作用,发现内聚失效界面上的相互作用主要由分散力引起,而粘合失效界面上的相互作用不仅涉及分散力,还涉及包括氢键在内的各种化学作用。官能团密度的变化会影响化学相互作用,但不会影响分散力,这一事实解释了粘合破坏和内聚破坏之间的选择性。
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来源期刊
Langmuir
Langmuir 化学-材料科学:综合
CiteScore
6.50
自引率
10.30%
发文量
1464
审稿时长
2.1 months
期刊介绍: Langmuir is an interdisciplinary journal publishing articles in the following subject categories: Colloids: surfactants and self-assembly, dispersions, emulsions, foams Interfaces: adsorption, reactions, films, forces Biological Interfaces: biocolloids, biomolecular and biomimetic materials Materials: nano- and mesostructured materials, polymers, gels, liquid crystals Electrochemistry: interfacial charge transfer, charge transport, electrocatalysis, electrokinetic phenomena, bioelectrochemistry Devices and Applications: sensors, fluidics, patterning, catalysis, photonic crystals However, when high-impact, original work is submitted that does not fit within the above categories, decisions to accept or decline such papers will be based on one criteria: What Would Irving Do? Langmuir ranks #2 in citations out of 136 journals in the category of Physical Chemistry with 113,157 total citations. The journal received an Impact Factor of 4.384*. This journal is also indexed in the categories of Materials Science (ranked #1) and Multidisciplinary Chemistry (ranked #5).
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