Deformable micro-supercapacitor fabricated via laser ablation patterning of Graphene/liquid metal

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Keon-Woo Kim, Seong Ju Park, Su-Jeong Park, Inae Kim, Bomi Park, Se Hyun Kim, Unyong Jeong, Jin Kon Kim, Chanwoo Yang
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Abstract

Deformable and miniaturized energy storage devices are essential for powering soft electronics. Herein, we fabricate deformable micro supercapacitors (MSCs) based on eutectic gallium-indium liquid metal (EGaIn) current collectors with integrated graphene. The well-define interdigitated electrode patterning with controlled gap is successfully realized by using the laser ablation because of a strong laser absorption of graphene and EGaIn. By judicious control of gap size between neighboring interdigitated electrodes and mass loading of graphene, we achieve a high areal capacitance (1336 µF cm−2) with reliable rate performance. In addition, owing to the intrinsic liquid characteristics of EGaIn current collector, the areal capacitance of fabricated MSC retains 90% of original value even after repetitive folding and 20% stretching up to 1000 cycles. Finally, we successfully integrate deformable MSC with a commercial light-emitting diode to demonstrate the feasibility of MSC as a deformable power source. The fabricated MSCs operate stably under various mechanical deformations, including stretching, folding, twisting, and wrinkling.

Abstract Image

Abstract Image

通过激光烧蚀石墨烯/液态金属图案制造可变形微型超级电容器
可变形和微型化的储能设备对于为软电子器件供电至关重要。在此,我们基于集成了石墨烯的共晶镓铟液态金属(EGaIn)集流体,制造出了可变形微型超级电容器(MSCs)。由于石墨烯和 EGaIn 对激光有很强的吸收能力,利用激光烧蚀技术成功实现了具有可控间隙的轮廓清晰的电极间图案化。通过合理控制相邻插接电极之间的间隙大小和石墨烯的质量负载,我们获得了具有可靠速率性能的高面积电容(1336 µF cm-2)。此外,由于 EGaIn 集流体的固有液态特性,即使反复折叠和拉伸 20%(最多 1000 次),所制造的 MSC 的面积电容仍能保持原始值的 90%。最后,我们成功地将可变形的 MSC 与商用发光二极管集成在一起,证明了 MSC 作为可变形电源的可行性。制成的间充质干细胞可在拉伸、折叠、扭曲和起皱等各种机械变形条件下稳定运行。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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