A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis

IF 2.4 4区材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING

Welding in the World Pub Date : 2024-03-11 DOI:10.1007/s40194-024-01743-3

Sinda Ghenam, Abdelkhalak El Hami, Wajih Gafsi, Ali Akrout, Mohamed Haddar

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引用次数: 0

Abstract

Given the tremendous growth of the microelectronics industry in recent years, soldering efficiency is more crucial than ever. Despite the great importance of the solder joints, these interconnections happen to be the weakest link in electronic packaging. Many surveys have been carried out in order to investigate their thermomechanical reliability but still incomplete since the electro-thermomechanical reliability is the one encountered in real operational services. A thorough insight into the multiphysics behavior of Pb-free solder joints is fundamental to enhancing the operational efficiency since the extent of their deterioration is a significant function of their compositions. This article investigates the response of various solder alloys (Sn63Pb37, SAC105, SAC305, SAC405, and InnoLot) to electrothermal loadings. The study explores their performance under different temperature conditions and examines factors such as melting temperature variations, residual stresses, and the impact of the IMC layer. The results highlight the superior reliability of SAC405, particularly regarding inelastic strain and premature damage. The study underscores the significance of mitigating these factors during electronics design and manufacturing to enhance solder joint lifetime. The findings contribute to advancing solder alloy reliability and improving electronic system performance.

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用于电热机械可靠性分析的不同合金成分多物理场比较建议

鉴于微电子行业近年来的迅猛发展，焊接效率比以往任何时候都更为重要。尽管焊点非常重要，但这些互连恰恰是电子封装中最薄弱的环节。为了研究这些焊点的热机械可靠性，已经进行了许多调查，但仍不全面，因为实际运行服务中遇到的是电热机械可靠性。彻底了解无铅焊点的多物理行为是提高运行效率的基础，因为它们的劣化程度是其成分的一个重要函数。本文研究了各种焊料合金（Sn63Pb37、SAC105、SAC305、SAC405 和 InnoLot）对电热负载的响应。研究探讨了它们在不同温度条件下的性能，并检查了熔化温度变化、残余应力和 IMC 层的影响等因素。研究结果凸显了 SAC405 的卓越可靠性，尤其是在非弹性应变和过早损坏方面。这项研究强调了在电子设计和制造过程中减少这些因素以提高焊点寿命的重要性。研究结果有助于提高焊料合金的可靠性和改善电子系统的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Welding in the World METALLURGY & METALLURGICAL ENGINEERING-

CiteScore

4.20

自引率

14.30%

发文量

181

审稿时长

6-12 weeks

期刊介绍： The journal Welding in the World publishes authoritative papers on every aspect of materials joining, including welding, brazing, soldering, cutting, thermal spraying and allied joining and fabrication techniques.