Breaking Barriers: The Symbiotic Interplay of Academia and Industry in Shaping Our Future

IF 2.5 4区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IETE Technical Review Pub Date : 2024-03-05 DOI:10.1080/02564602.2024.2306736

Mamidala Jagadesh Kumar

引用次数: 0

Abstract

Published in IETE Technical Review (Vol. 41, No. 1, 2024)

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打破障碍：学术界与产业界在塑造未来中的共生互动

发表于《IETE 技术评论》（第 41 卷，第 1 期，2024 年）

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IETE Technical Review 工程技术-电信学

CiteScore

5.70

自引率

4.20%

发文量

审稿时长

9 months

期刊介绍： IETE Technical Review is a world leading journal which publishes state-of-the-art review papers and in-depth tutorial papers on current and futuristic technologies in the area of electronics and telecommunications engineering. We also publish original research papers which demonstrate significant advances.