Optimization of Hemispherical Shell Resonator Structure Based on Thermoelastic Dissipation

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiaoyan Sun;Haikuan Chen;Zhouwei He;Haoning Zheng;Ji’an Duan;Youwang Hu
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Abstract

This paper reports a method to optimize the structure of a hemispherical shell resonator by reducing the thermoelastic dissipation. In accordance with the thermoelastic damping theory, we set up a thermal insulation structure to change the heat conduction distance to improve the thermoelastic quality factor. And according to the distribution of elastic strain energy on the resonator, we set up the thermal insulating cavities and thermal insulating layers at the top and rim of the resonator to change the heat conduction distance, respectively. The vibration characteristics of the four new resonators are compared with the conventional resonator by finite element calculation, and the new structural resonators are fabricated with the optimal parameter. We measured that the quality factor ( $Q$ -factor) of the optimized resonator was improved by 13.8 times than that of the original structural resonator. It is also found that by adjusting the insulation structure, not only the thermoelastic quality factor of the resonator can be improved, but also the modal frequency of the resonator can be adjusted, which is able to realize the fine control of the vibration characteristics of the resonator. [2023-0168]
基于热弹性耗散的半球壳谐振器结构优化
本文报告了一种通过减少热弹性耗散来优化半球壳谐振器结构的方法。根据热弹性阻尼理论,我们设置了隔热结构来改变热传导距离,从而提高热弹性品质因数。并根据弹性应变能在谐振器上的分布,在谐振器顶部和边缘分别设置了隔热腔和隔热层,以改变热传导距离。通过有限元计算将四种新型谐振器的振动特性与传统谐振器进行比较,并以最优参数制造出新型结构谐振器。我们测得,优化谐振器的品质因数($Q$因子)比原始结构谐振器提高了 13.8 倍。研究还发现,通过调整绝缘结构,不仅可以提高谐振器的热弹性品质因数,还可以调整谐振器的模态频率,从而实现对谐振器振动特性的精细控制。[2023-0168]
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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